April 3, 2006 Montreal, Canada -- Reflex Photonics , a developer of high speed connectivity platforms for semiconductor IC packaging and data transfer applications, recently announced the availability of its initial products, along with the company's "technology roadmap."
"We are focused on the enterprise/data center and telecom optical switch/router spaces, with inter-system connectivity of up to 1000 feet. We are currently sampling our InterBoard 12 channel, 40-Gbit/sec line of pluggable, industry compatible, SNAP 12 MSA [multi-source agreement] transmitter and receiver modules," says Gary Moskovitz, president and CEO of Reflex Photonics.
Moskovitz continues, "During the next quarter, we will be launching our follow-on InterBoard products incorporating DDR [double data rate] channel speeds of up to 6.25 Gbit/sec. Later this year we expect also to be demonstrating prototypes of products with both 10 and 12.5 Gbit/sec channel speeds, achieving up to 150 Gbit/sec modular throughput. In support of the newly-developing industry standard, we also intend to incorporate 4 channel, bi-directional QSFP [quad small form factor] MSA-compliant modules into our InterBoard product line. All of our InterBoard products are engineered to support most of the inter-system physical layer protocols such as Infiniband SDR/DDR/QDR, Fibre Channel, Ethernet and SONET/SDH."
The company says its "Light On Board" products will incorporate chip-to-chip and fiber-to-the-chip capabilities regarding its optically-enabled, "LightAble" hybrid semiconductor IC packaging platform. The company says its semiconductor IC packages will "revolutionize" the way processors and high-performance chips communicate by using multi-channel, optical fiber ribbon cables or optical waveguides, instead of copper traces, to carry data "onto, across, and within" standard printed circuit boards. The Light On Board products will support PCI, PCI-X, PCI Express, HyperTransport, RapidIO and other proprietary onboard physical layer protocols.
"We were able to take advantage of the post-bubble doldrums to make significant improvements in the structure and packaging of the components that deal with electrical-to-light conversion and vice versa," comments Dr. David Rolston, co-founder and CTO of Reflex Photonics. "Our optical sub-assembly, which incorporates our proprietary LightAble optical engine technology, features a unique low cost, low profile, passive optical assembly process whose modular construction allows for volume manufacturing, superior performance and much higher reliability as compared to existing technology implementations developed some years ago and still in the market. We basically handle high data rates faster, better and less expensively than any competing technology - and by quite a bit."
"Our goal is to provide a terabit of data through our multi-channel ports, with multiple ports embedded within targeted Flip Chip (FC)-Ball Grid Array (BGA) chip carrier packages. We intend to be the driving force behind the industry's acceptance of optically-enabled, opto-electronic printed circuit board modules and their optical pathways," concludes Moskovitz.