OIF product showcase at OFC to highlight ongoing work

The OIF says that it will support a product showcase at OFC next month in San Francisco that will illustrate the implementation agreements and ongoing projects from the OIF’s Physical and Link Layer (PLL) activities.

Agilent Technologies, Amphenol, Applied Micro, Finisar, Inphi, Molex, MoSys, NEC, NeoPhotonics, Oclaro, Picometrix, Semtech, TE Connectivity, Xilinx, and Yamaichi Electronics will participate in the showcase. The vendors will demonstrate technology based on such OIF implementation agreements as the Common Electrical Interfaces (CEIs) for 28G very short reach (VSR), short reach (SR), and medium reach (MR) as well as the 25G long reach (LR) applications. Products that incorporate the OIF’s MultiLink Gearbox and components for next generation long haul and coherent optics also will be on display.

“We are excited for the industry to reflect how many different OIF IA projects are being applied to real-world products that are either available today or are being readied for deployment,” said Brian Holden of Kandou Bus and the OIF’s Marketing Education & Awareness Committee co-chair. “It is encouraging to see the Forum’s work coming to fruition.”

The OIF will hold the product showcase in booth #2309.

Meanwhile, the OIF also will participate in two panels in the OFC Expo Theatre III. The panel “56 Gbps Serial – Why, What, When” on Wednesday, March 12 from 11 AM to 12 PM will cover implications, applications, and roll-out of 56-Gbps interfaces in a broad system-oriented context. The second panel, “Carrier SDN Drivers and Evolution,” will be held on the same day from 2 to 3 PM. It will highlight the new networking approaches of software-defined networking (SDN) and network functions virtualization (NFV) and how the OIF is helping to define the role of optical transport networks in these new architectures.

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