Ardent Concepts, Inc. has added 32-Gbps OEM optical interposers to its CA Series. The OEM optical connectors can be designed to fit specific needs and delivered with short lead times, the company says.
The interposers support what Ardent describes as "extremely high node count requirements" without extreme force. Contact heights can be as low as 0.030 inches to reduce stack up heights without sacrificing signal integrity. The company asserts the scalability of its CA Series technology helps enable the design of solderless high speed electro-optical modules.
"Many of our customers are building large-scale systems and need to plan for future optical module upgradability and/or replacement," explained Ardent President and CTO Gordon Vinther. "In the past, most data transmission modules were soldered down in manufacturing and required expensive rework to introduce new designs or replace faulty modules."
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