Kaiam offers 100G-CWDM4 transceivers based on LightScale2 Platform

Sept. 25, 2017
Kaiam Corp. has announced general availability of the XQX5000-series of QSFP28 100G-CWDM 4 transceivers based on its LightScale2 platform. By eliminating hermetic "gold boxes" and flex circuits, Kaiam says the LightScale2 platform minimizes parts and manufacturing costs, while providing improved electrical and thermal performance.

Kaiam Corp. has announced general availability of the XQX5000-series of QSFP28 100G-CWDM4 transceivers based on its LightScale2 platform. By eliminating hermetic "gold boxes" and flex circuits, Kaiam says the LightScale2 platform minimizes parts and manufacturing costs, while providing improved electrical and thermal performance.

The company unveiled the LightScale2 platform at ECOC 2016 (see "Kaiam launches LightScale2 transceiver platform at ECOC"). Kaiam says it sold its Newton Aycliffe fabrication facility to II-VI to generate the necessary expansion capital for the build-out of LightScale2 manufacturing capacity. According to Kaiam, volume production of the LightScale 2 out of its Livingston, UK, facility is meeting the demand of multiple customers.

"The LightScale2 production ramp has gone very smoothly," said Russell Childs, Kaiam Europe Ltd. general manager. "Our UK factory has manufactured traditional hermetic TOSAs and ROSAs in high volumes for years. The LightScale2 platform is far simpler to manufacture in terms of assembly steps, capital equipment, and labor. This has allowed us to ramp to high volumes with high yields much more quickly than was possible with more complex legacy products."

Earlier this year, Kaiam Corp. and Corning Inc. teamed up to demonstrate an optical engine and single-mode fiber interface connector that could be co-packaged with a 12.8-Tbps switch chip (see "Kaiam and Corning team to demo optics/switch chip co-packaging"). Through partnerships and foundry services, Kaiam says it will continue InP photonic integrated circuits (PICs) development for future transceiver products.

"Our micromechanical alignment technology allows multimode packaging techniques to be used in a single mode application," said Bardia Pezeshki, Kaiam CEO. "The Lightscale2 platform is optimized to deliver maximum value and performance in the data center environment at dramatically lower costs than traditionally aligned hybrid approaches."

For related articles, visit the Optical Technologies Topic Center.

For more information on optical components and suppliers, visit the Lightwave Buyer's Guide.

Sponsored Recommendations

Scaling Moore’s Law and The Role of Integrated Photonics

April 8, 2024
Intel presents its perspective on how photonic integration can enable similar performance scaling as Moore’s Law for package I/O with higher data throughput and lower energy consumption...

Supporting 5G with Fiber

April 12, 2023
Network operators continue their 5G coverage expansion – which means they also continue to roll out fiber to support such initiatives. The articles in this Lightwave On ...

From 100G to 1.6T: Navigating Timing in the New Era of High-Speed Optical Networks

Feb. 19, 2024
Discover the dynamic landscape of hyperscale data centers as they embrace accelerated AI/ML growth, propelling a transition from 100G to 400G and even 800G optical connectivity...

Advancing Data Center Interconnect

July 31, 2023
Large and hyperscale data center operators are seeing utility in Data Center Interconnect (DCI) to expand their layer two or local area networks across data centers. But the methods...