The AFBR-700SDZ optical transceiver supports high-speed serial links over multimode optical fiber at signaling rates up to 10.313 GBd. Real-time temperature, supply voltage, laser bias current, laser average output power, and received input power information is provided with the two-wire interface defined in SFF-8472. The digital diagnostic interface also adds the ability to disable the transmitter, monitor for transmitter faults, and monitor for receiver loss of signal.
Avago Technologies, www.avagotech.com
The IPTA12G011 and IPVD12G011 four-channel transimpedance amplifier (TIA) and four-channel VCSEL driver reportedly offer the lowest power in the industry, and are optimized for computer communications requirements for low power, high density, and low cost. The devices offer less than 8 mW per Gbit/sec and no crosstalk and require no external components, resulting in cost-effective, robust, high-density offerings. These features can enable better grid efficiency, significantly lower power, cost savings, and more data crunch in supercomputers, server farms, remote storage, and other applications.
IPtronics A/S, www.iptronics.com
The company�s universal optical EMI adapter now features LC capability. The EMI adapters were developed to increase shielding effectiveness and enhance front panel aesthetics compared to traditional plastic adapters. Their versatile design provides interchangeable user interfaces including LC, SC, ST, and FC, allowing easy conversion for multiple applications, including telecommunications equipment, lab, storage servers, and test equipment. The adapters are available for customized configuration prior to shipping or after delivery.
Molex Inc., www.molex.com
Packet optical networking platform
The FLASHWAVE 9500 system is part of the new packet optical networking platform (PONP) product class. Reportedly the industry�s densest optical networking platform, the PONP integrates connection-oriented Ethernet, reconfigurable optical add/drop multiplexer (ROADM), and SONET technologies in one-third of a rack. The pluggable ROADM and integrated 480G SONET and Ethernet switching capabilities significantly lower the cost of packet-centric metro networks.
Fujitsu, http://us.fujitsu.com/telecom
The company�s optical channel monitor (OCM) uses an arrayed waveguide (AWG) to separate a multiplex of wavelengths into individual waveguides and has integrated photodetectors for optical-electrical signal conversion. The AWG allows fast, parallel measurement of all channels. The compact device includes an internal temperature controller for stabilization of the AWG chip. The output of the device is an array of electrical pins corresponding to each channel in the multiplex. Standard devices are for 100-GHz grid applications; other grids can be supported.
ANDevices Inc., www.andevices.com
The Pod is an economical answer to any industry that needs a mobile laboratory. The product was designed specifically for the telecom market as a lightweight, easily portable fiber-optic splicing lab. It is a totally enclosed, dust-free environment that can be pulled by a light truck. The trailers have completely customized configurations. Standard interiors (interior lights, A/C, cabinets, countertops, etc.) are offered, with many options available (heater, additional exterior lights, shield/guard holders, generator upgrade, and more).
Pelsue, www.pelsue.com
Micropolishing tool
Scratched and damaged optical connectors can be efficiently repaired with the Rev Polisher. Whether damaged by high-powered lasers, repeated matings, or general handling, the polisher processes fiber connectors to their original surface finish in as little as 15 sec. Critical endface geometries are maintained by Rev�s patented optical alignment mechanism. Interchangeable workholder fixtures support all industry-standard and custom connector types, as well as bare fibers.
Krell Technologies, www.krelltech.com
An advanced CAD 8.0 system has been released for the Component Design Suite. The new CAD version adds 3D editing capability, a streamlined design process, and an updated appearance to the company�s flexible and user-friendly interface. The 3D feature allows users to manipulate and view their designs along any direction as well as in all three dimensions; enabling designers to more readily create and view complex designs. The complete line of passive device simulation tools, including BeamPROP, FullWAVE, BandSOLVE, GratingMOD, DiffractMOD, and FemSIM, will take advantage of this new CAD environment. The new capabilities extend the targeted range of photonics applications in the optoelectronics, communications, and semiconductor industries.
RSoft Design Group, www.rsoftdesign.com