Components Featured Articles

Intel hopes for revolution with Light Peak optical interconnect

Intel believes that Light Peak, its high-speed optical interconnect technology, will be integrated within all PCs and consumer electronic devices in the next couple of years. If this comes to pass,...

Tunable XFPs positioned to replace 300-pin modules

APRIL 1, 2010 By Stephen Hardy -- The promise of tunable, pluggable transceivers, especially XFPs, is finally beginning to be realized. While initial applications involve replacing fixed-wavelength...

PIC-based transceivers enable cost-effective 1G to 10G PON migration

By Andy Weirich Overview To meet the demands of both performance and cost, photonic integrated circuit (PIC) technology is the best choice for PON transceivers. Despite the global economic...

Optical integration through planar lightwave circuits

By Dr. Matt Pearson Overview Planar lightwave circuit (PLC) technology, originally developed for low-cost optical access products, is now being applied to other markets, including advanced...

Dispersion compensation technology advances

By Adel Asseh, PhD Overview Combining the power of fiber Bragg gratings with the simplicity of an ordinary patch cord results in a space-saving, cost-effective approach to dispersion compensation....

Photonic integration diverges down two paths

by Stephen Hardy The need to lower cost, power consumption, and package size has led to significant advancements in photonic integration. Infinera (www.infinera.com) has made the biggest splash in...

CML and EML see eye to eye

by Daniel Mahgerefteh For the past two decades, high–performance optical transmitters for 10–Gbit/sec telecommunications systems have relied upon external modulators to maintain signal...

The next future of DWDM: 100 Gbps

by Niall Robinson OVERVIEW With 40 Gbps DWDM now in deployment, carrier and technology developer attention has turned to 100 Gbps. Three key factors will determine the timing of 100-Gbps DWDM...

Passive PICs are key elements in 40- and 100-Gbps systems

by Anthony Ticknor and G. Ferris Lipscomb OVERVIEW The transition to phase-modulated modulation formats for 40 and 100 Gbps puts new demands on passive component technology. Silica-on-silicon...

Internally compensated digital VOA modules improve cost

by Xinzhong Wang and Yao Li OVERVIEW The need to increase integration and standardize interfaces pertains to a variety of modules, including variable optical attenuators (VOAs). New technology can...