Lightwave White Papers

Newly Developed High Performance Epoxy Adhesives Revolutionize Structural Bonding

Fri, 17 Jul 2009 15:26:52 GMT

Newly developed high performance epoxy adhesive systems offer an increasingly technical and economic advantage over traditional mechanical fasteners for even the most demanding load bearing assemblies. Properly selected, designed and assembled they can and do produce structures that can transmit severe structural stresses without loss of structural integrity with significant savings of time and money. The extensive use of structural adhesives in the construction of the super-size Airbus A380 jet as well as at Boeing's most advanced transport planes is a dramatic illustration of high technology¿s confidence and larger employment of this assemble method. Epoxy resins on account of their physical strength chemical resistance properties and ready processability are recognized as the undisputed leader of high strength structural bonding. They also offer such important additional advantages as outstanding fatigue and thermal shock resistance, ability to bond dissimilar materials e.g. glass to metals or plastics, corrosion resistance, less critical tolerances in design because of their gap filling capability, and exceptionally wide service temperature range which extends from space environments to as high as 600F! Careful joint design and appropriate surface pretreatments of the areas to be bonded are essential to take full advantage of the versatility and performance potential of structural epoxy adhesive compounds. Specific design and application methods have been developed for optimal use of epoxy resins. They comprise both one component heat curable and two component formulations which cure at either ambient or elevated temperatures. Recently, light curable compounds which "cure on demand" in a matter of seconds have been commercialized. Positive contact pressure application suffices for cure. Properties can be further enhanced by addition of glass, graphite, Kevlar and other reinforcing fibers as well as functional fillers and many other specialty ingredients. Major individual and product applications for structural epoxy include the following: aerospace and defense; oil serving and drilling industries; sporting goods; bridges and other civil engineering structures; electronic assemblies; computers; medical devices; automotive components; boats and other marine applications. The number of uses is steadily expanding fueled by the increasing need for lighter weight, more corrosion and cost effective assemblies with typical overall savings of 50-80% or more compared to conventional fasteners.

TEST - Dispersion Limits in 10 GigE Transmission Systems

Fri, 17 Jul 2009 15:26:52 GMT

The increased transmission speed of 10 Gbps or more is limited by dispersion phenomenon, specifically, polarization mode dispersion (PMD) and chromatic dispersion (CD). These parameters must be considered when deploying or upgrading to 10 GigE capabilities.

TEST - E-book: Triple-Play Service Deployment - A Comprehensive Guide to Test, Measurement, and Service Assurance

Fri, 17 Jul 2009 15:26:52 GMT

JDSU offers a free, authoritative resource that presents in-depth guidance on testing FTTx networks and ensuring reliable triple-play service delivery.

TEST - E-book: The JDSU Reference Guide to Fiber Optic Testing

Fri, 17 Jul 2009 15:26:52 GMT

The JDSU Reference Guide to Fiber Optic Testing is written for fiber optic installers, project managers, telecom technicians, and engineers who need to understand, apply, and correctly measure and record the performance of fiber infrastructures. This first volume reviews the basics in systems, standards, and network architectures and focuses on how to make the most of Optical Time Domain Reflectometers (OTDRs) to install, turn-up, and maintain fiber optic networks. The book covers: • Basic system and fiber infrastructure design • Basic fiber infrastructure testing • Basic OTDR testing • Advanced OTDR testing Listen to Podcast Overview of this eBook from JDSU. Click Here to Play Now

TEST - Considerations for High Speed PCB Track Design in 10Gb/s Serial Data Transmission

Fri, 17 Jul 2009 15:26:52 GMT

A fundamental evaluation of a variety of approaches for designing a high-speed (10 Gb/s) serial differential electrical channel is examined. The application of the electrical interface has been simulated using HSpice software. It demonstrated how the signal quality could be affected by the use of microstrip vs. stripline traces and their associated advantages and disadvantages is discussed. Example XFI channels were assembled from the simulation results to demonstrate viability of the application.

TEST - Newly Developed High Performance Epoxy Adhesives Revolutionize Structural Bonding

Fri, 17 Jul 2009 15:26:52 GMT

CLICK Test Whitepaper

Fri, 17 Jul 2009 15:26:52 GMT

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Dispersion Limits in 10 GigE Transmission Systems

Fri, 17 Jul 2009 15:26:52 GMT

E-book: Triple-Play Service Deployment - A Comprehensive Guide to Test, Measurement, and Service Assurance

Fri, 17 Jul 2009 15:26:52 GMT

JDSU offers a free, authoritative resource that presents in-depth guidance on testing FTTx networks and ensuring reliable triple-play service delivery.

E-book: The JDSU Reference Guide to Fiber Optic Testing

Fri, 17 Jul 2009 15:26:52 GMT

Considerations for High Speed PCB Track Design in 10Gb/s Serial Data Transmission

Fri, 17 Jul 2009 15:26:52 GMT