Optical component and transceiver developer Source Photonics says it has opened a new laser fabrication and assembly facility. The facility, located in Jintan, China, will double the company’s production capacity for Indium Phosphide (InP) lasers and related components. Source Photonics also operates a fab in Hsinchu, Taiwan, which has seen its capacity double as well over the last three years.
The Jintan plant offers fully integrated laser chip production, precision TO operations, and an R&D facility. The chip capabilities include base wafer, regrowth, and chip processing. Source Photonics says the TO operations will support high-speed PON and 5G market requirements. These capabilities will complement those of the 20-year-old Hsinchu facility, which has seen expansion in MOCVD and advanced coating capabilities as well as optical transceiver assembly.
“These new investments support our integrated manufacturing approach, which is critical to meeting the ever-growing needs of our customers,” said Doug Wright, CEO of Source Photonics (SP). “Managing the entire value chain from laser production through transceiver assembly gives SP differentiated capability that enhances speed to market, yields manufacturing innovations, and offers flexibility our customers demand.”
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