3M develops packaging for high-speed data transmission, switching and computation applications
Aug. 24, 2001--3M announced a new solution that is expected to double the performance of high-end semiconductor and opto-electronic packages.
3M announced a new solution that is expected to double the performance of high-end semiconductor and opto-electronic packages. An innovation in materials science is enabling 3M to help its telecommunications customers make the leap from OC-192 to OC-768 (or 10 Gbps to 40 Gbps). This proprietary new technology also will benefit network applications, such as routing and switching, as well as server and workstation applications.
Ever-increasing amounts of data are being transmitted over networks, switched and processed by computer systems. The required increase in buss speed and width needed to satisfy these demands also increases sensitivity to electrical noise, greatly affecting system performance.
3M's new packaging solution dramatically lowers both simultaneous switching output (SSO) noise and core sag, allowing operation of wide (>128 bit) busses with buss speeds in the gigahertz range.
"Increases in buss speeds and width are placing harsh demands on IC packages, and packaging technologies currently in use will soon become unable to provide the low SSO noise levels required for workstation, server, network backbone and metro area applications," says Paul Fischer, head of 3M Microelectronic Packaging Project.
Selective prototyping is currently underway at the 3M Eau Claire, Wis., plant microelectronics packaging facility.
3M provides solutions, including both rigid and flexible microinterconnects, to the electronics and telecommunications markets. For more information, visit www.3M.com/microelectronic.