Mitsubishi Electric develops 10G XMD-MSA module
APRIL 24, 2007 -- Mitsubishi Electric Corp. says it has developed a cooling-type electro absorption modulator integrated DFB-LD (EAM-LD) module for DWDM applications.
APRIL 24, 2007 -- Mitsubishi Electric Corp. (search for Mitsubishi) says it has developed a cooling-type electro absorption modulator integrated DFB-LD (EAM-LD) module for DWDM applications. The module is one of the smallest and lowest power consuming in the industry, the company claims. The DWDM EAM-LD chip (ML9XX44) is mounted in an XMD-MSA compatible TOSA that is appropriate for 10-Gbit/sec transmission over 80 km of standard singlemode fiber.
The 10-Gbit/sec Miniature Device Multi-Source Agreement (XMD-MSA) has been created to establish compatible sources of optical modules for use in the small optical transceivers such as the XFP, XENPAK, etc. Thus, Mitsubishi Electric's new DWDM EAM-LD module is suitable for 10-Gbit/sec small-form-factor optical transceivers such as the XFP, enabling cost-effective 10-Gbit/sec optical links for long distance (longer than 40 km) and metropolitan-area applications with high board density.
The DWDM EAM-LD module can transmit a high-quality 10-Gbit/sec optical signal with a typical maximum power consumption of less than 0.8 W. Using Mitsubishi's original high-frequency interconnection technology, the company says it has successfully developed a high-frequency signal transmission line in the module, "which cannot be an influx route of heat outside from the module so as to result in a degradation of its cooling capacity of its thermo-electric cooler," in the words of the company's press release.
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