Avo Photonics touts TO-can packaging capabilities

October 29, 2004 Horsham, PA -- Avo Photonics has begun to offer design, development, and manufacturing services for TO-can packages, including TO-38 assembly. Avo also offers additional TO-styles, including TO-3, TO-46, and TO-56.

Oct 29th, 2004

October 29, 2004 Horsham, PA -- Avo Photonics has begun to offer design, development, and manufacturing services for TO-can packages, including TO-38 assembly. Avo also offers additional TO-styles, including TO-3, TO-46, and TO-56.

"Many OEMs are looking to move away from more expensive packaging solutions, such as butterfly designs," said Dr. Paul Magill, CTO and vice president of business development at Avo. "By offering assembly and design for a variety of TO-style packages, we can help simplify solutions and reduce customer costs."

"Avo continues to provide us with extremely high-quality engineering design work and manufacturing, with detailed attention paid to design for manufacture and qualification from the concept stage," said Tom Haslett, CTO of Photonami. "Avo has consistently demonstrated a high level of expertise in the design and assembly of TO and other optical subassemblies. In all our projects with Avo, we have enjoyed the strong commitment to design for manufacture, quality-controlled manufacturing and meeting aggressive deadlines."

In addition to offering assembly services, Avo works with customers to transition designs from complex packages such as a butterfly to TO-can designs. Avo provides complimentary initial technical consultation and proposals in as little as 24 hours, the company says.

Avo supports its design capabilities with a suite of modeling tools -- including RF, optical, thermal, and mechanical analysis -- so that products are ready for immediate prototyping and low-volume production, as well as the ability to flow to high-volume production without having to retool or requalify the design. In addition to TO-cans, Avo also provides support for custom and standard package designs.

Manufacturing processes to support these packages include: laser welding, die bonding, flip chip, wire bonding, seam sealing, and optical fiber attach. Avo also provides failure analysis and supply chain management.

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