Amicra Microtechnologies GmbH, founded in 2001 and headquartered in Regensburg, Germany, provides leading-edge products and engineering services for backend manufacturing and packaging processes to customers in multiple segments of the electronics industry such as semiconductors, fiber-optics and optoelectronics, automotive sensors, LED and MEMS. With its latest micro-assembly solutions for flip-chip and die-attach Amicra has evolved and optimized traditional bond processes in terms of high precision and low cost. Amicra maintains a global sales and support network with representative offices throughout Europe, Northern Africa, Israel, Asia Pacific and China, as well as on the U.S. East Coast and Northern and Southern California. More information: www.amicra.com.