OIF commences work on ultra-high data rate interface specifications

July 28, 2005 Fremont, CA -- Optical Internetworking Forum (OIF) members convened in Brussels this month to begin work on defining system and component requirements for future intra-system interfaces. The forum says its Physical Layer User Group has begun work on specifications for ultra-high data rate interfaces including 100, 120, and 160 Gbit/sec, that will enable a higher density than the organization's current Common Electrical Interface (CEI).

July 28, 2005 Fremont, CA -- Optical Internetworking Forum (OIF) members convened in Brussels this month to begin work on defining system and component requirements for future intra-system interfaces. The forum says its Physical Layer User Group has begun work on specifications for ultra-high data rate interfaces including 100, 120, and 160 Gbit/sec, that will enable a higher density than the organization's current Common Electrical Interface (CEI).

Initial contributions from the forum's Physical Layer User Group members on the high data rate interface will be reviewed at the OIF's October meeting in Florida.

"Our members are seeing exponential growth in data traffic and a corresponding demand for higher bandwidth," comments Karl Gass of Sandia National Laboratories, and OIF Physical Layer User Group chair. "Forward-looking companies need to identify requirements for their next generation of products, three to five years down the road. These intra-system requirements will form the basis of future PLL interface development work."

Also, according to a press release, the OIF's Architecture & Signaling Working Group is continuing to refine the ENNI signaling Interoperability Agreement (IA). The group says it is applying lessons learned in the OIF's Worldwide Interoperability Demonstration to ENNI, while enhancing the agreement to include support for UNI 2.0 services across the ENNI link. The Worldwide Interoperability Demonstration, unveiled at June's Supercomm, spanned seven global carrier host labs with 13 vendors participating.

"Based on our interoperability experience, the OIF is making material contributions to the existing UNI 2.0 specification," remarks Jonathan Sadler of Tellabs, and OIF Architecture & Signaling Working Group chair. "The Worldwide Interoperability Demonstration is an important element in testing and applying the technical work that the OIF creates."

Also, the forum's Physical Link Layer Working Group (PLL WG) announce that it has begun working on a project to define Maintenance and Diagnostic (M&D) features for the high speed Common Electrical Interface (CEI). Further, the PLL WG says that another of its project starts builds on the OIF's Electronic Dispersion Compensation (EDC) work by addressing interoperability for EDC-enabled Extended Reach (ER) transponders.

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