TranSwitch introduces TXC-OMNI silicon/software solutions for metropolitan area network systems
July 22, 2002--TranSwitch Corp., a developer of high-speed semiconductor solutions, today announced TXC-OMNI, a silicon and software solution for next-generation add/drop multiplexers, digital crossconnects, and hybrid time-division multiplexing/data switching systems. TXC-OMNI is the only solution that provides in-service migration from wideband to broadband transport and from TDM to data switching for metropolitan area networks.
The TXC-OMNI solution, a core element in TranSwitch's metro evolution strategy, includes the TXC-OMNI switch element (SE), the TXC-OMNI transport processor (TP) and an advanced support package, including distributed API, silicon firmware, diagnostic software, simulators and a fully functional TXC-OMNI reference system with reference designs.
The TXC-OMNI SE is a highly integrated 12-port fully non-blocking time-space switch element that simultaneously supports TDM and data switching in native format. With an aggregate capacity of over 30 Gbits/sec, on-board RISC processor, full support of multi-stage switch architectures and integrated serializer/deserializer (SerDes) link, the TXC-OMNI SE serves a multitude of next generation multi-service metro network applications. The TXC-OMNI SE provides switching granularity that includes VT1.5 (virtual tributary), TU-11/TU-12 (tributary unit), STS-1, and VC-3 (virtual container) without connectivity restrictions. With a scalable multi-stage architecture, equipment vendors can develop metro switches with capacities over 1-Tbits/sec.
The TXC-OMNI TP is a highly integrated add/drop multiplexer on a chip designed for equipment providers addressing the add/drop multiplexer/crossconnect market. The TXC-OMNI TP provides SONET/SDH framing, full SONET/SDH protection mechanisms, and high and low order pointer processing. The TXC-OMNI TP also provides programmable processing granularity from VT1.5/TU11/12 up to STS-48c/AU4-16c levels in a single VLSI device. Finally, it offers integrated backplane SerDes for both primary and secondary data paths, which eliminates external components and improves the reliability of the system.
Bundled with the TXC-OMNI SE and TXC-OMNI TP are comprehensive software and development tools. The software package includes a service-aware API that simplifies code development, thus, allowing engineers to focus on embedded application development instead of hardware register configuration. This software package also includes advanced tools consisting of a complete API simulator, system-level diagnostic software, compilers, assemblers, and debuggers, significantly reducing development time for original equipment manufacturers.
"The telecommunications industry is undergoing unprecedented change that will fundamentally affect customer needs along the entire supply chain. Gone are the days of rapid deployment of new technologies and revolutionary new network architectures. The new challenge for equipment suppliers is to reduce development costs while producing systems that foster network evolution," observes Paul DeBeasi, TranSwitch's vice president of marketing. "The new products we are announcing today provide highly flexible metro evolution silicon while dramatically reducing software development costs and time."
The TXC-OMNI SE, a 624-lead PBGA, is sampling now with customers and the TXC-OMNI TP, a 1088-lead PBGA, is expected to sample fourth quarter 2002. In volume, the TXC-OMNI SE is priced at $1,100 per unit and the TXC-OMNI TP is priced at $1,350 per unit.
TranSwitch Corp., headquartered in Shelton, Connecticut, is a global supplier of high-speed VLSI semiconductor solutions to original equipment manufacturers. For more information, visit the company's Web site at www.transwitch.com.