Namics, Diemat announce merger

MARCH 17, 2008 -- The companies expect the agreement will provide new opportunities for customers to benefit from expanded capabilities, complementary technologies, and expanded product lines.

MARCH 17, 2008 -- Namics Corp. and Diemat Inc. have completed a merger agreement. The companies expect the agreement will provide new opportunities for customers to benefit from expanded capabilities, complementary technologies, and expanded product lines.

Diemat, founded in 1988, will maintain its brand identity and will continue to operate with the involvement and technical guidance of its founder, Ray Dietz. Dietz holds more than 25 patents. Namics will support the technology, manufacturing, and marketing efforts as Diemat continues to grow.

Located in Byfield, MA, 30 miles north of Boston, Diemat specializes in the development and manufacturing of adhesive and sealing materials to serve the electronic and photonic packaging industry. The company has expertise in chemical engineering, polymer chemistry, material science, and electronics.

Namics offers high-technology underfills, encapsulants, coatings, specialty adhesives, and insulating and conductive materials for use by the producers of semiconductor devices, passive electronic components, and electrical devices. It is headquartered in Niigata, Japan, with subsidiaries in the USA, Europe, Singapore and China.

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