On May 16, Digital Realty announced the availability of its liquid-to-chip cooling technology as part of its standardized high-density colocation offering. The company calls it a leap forward in addressing the challenges of managing high-density workloads, particularly those involving AI and data-intensive applications.
Digital Realty’s chief technology officer, Chris Sharp, said in a press release, “We’re proud to align with our customers in evolving their infrastructure to support this cutting-edge liquid-to-chip technology, enabling them to land and expand their deployments efficiently and redefine what’s possible in the digital age. With this cutting-edge liquid-to-chip cooling technology, we’re not just setting a new standard for high-density deployment support, we’re revolutionizing the digital infrastructure landscape.”
The company reports that its DLC offering, when combined with its rear door heat exchangers (RDHx), effectively doubles the power densities that can be supported. The solution is currently available in 170 data centers around the globe, and the company has plans to expand to additional sites.
Sean Graham, Cloud to Edge Datacenter Trends research director at IDC, said in the same press release, “Organizations are increasingly investing in generative AI and high-performance computing and need private, high-density environments. Digital Realty’s HD Colocation offering is a strong response to the flourishing market need for high-density racks and presents an ideal solution to significantly accelerate time-to-value for these organizations while avoiding the need for lengthy and costly capital projects to build or retrofit new capacity. This offering aligns with IDC’s colocation provider recommendations for the gen AI market.”
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