Master Bond introduces low viscosity, high strength structural adhesive

August 2, 2005 Hackensack, NJ -- Master Bond has developed a two-component epoxy adhesive for high performance bonding applications called EP30. The company says the adhesive develops outstanding physical strength properties even when cured at ambient temperatures. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements.

Th 183095

August 2, 2005 Hackensack, NJ -- Master Bond has developed a two-component epoxy adhesive for high performance bonding applications called EP30. The company says the adhesive develops outstanding physical strength properties even when cured at ambient temperatures.

Cure can be accelerated by use of moderate heat. According to the company, EP30 features very low viscosity along with outstanding chemical resistance, dimensional stability, hardness, and superb optical clarity. The company says that the adhesive's electrical insulation properties are superior even upon prolonged exposure to moisture. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements.

According to the company, EP30 has excellent adhesion to a wide variety of substrates including metals, ceramics, glass, and many plastics. Typically, the adhesive's lap shear strength exceeds 3,000 psi for aluminum to aluminum bonds. EP30 also has exceptionally low shrinkage upon cure, and is especially suited for assemblies where only very thin bond lines are dictated by design considerations.

EP30 is available in ½-pint, pint, quart, gallon, and 5 gallon kits. It is also available in gun applicators and double pouch divider packs for ease of application.Th 183095

More in Home