Palomar Technologies intros new wire bonder

18 July 2003 Vista, CA Lightwave -- Palomar Technologies has introduced the Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12x6-inch (300x150 mm) X-Y bond area, it can handle large hybrids, multichip modules, or several smaller devices at one time. The bonder is capable of placing eight wires per second with a table repeatability of better than ± 5 microns.

Jul 18th, 2003

18 July 2003 Vista, CA Lightwave -- Palomar Technologies has introduced the Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12x6-inch (300x150 mm) X-Y bond area, it can handle large hybrids, multichip modules, or several smaller devices at one time. The bonder is capable of placing eight wires per second with a table repeatability of better than ± 5 microns.

A combination of the Cognex 8000 vision system and dual-source programmable LED lighting also facilitates accurate targeting and placement. This level of positioning accuracy, along with highly repeatable ball formation, enables tight spacing between wires. Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications.

"We threw out any pre-conceived notions and asked our customers and wire bonding process engineers what they considered to be an ideal wire bonder," said Jerry Jordan, product marketing manager at Palomar Technologies. "Many of the features of the 8000 bonder evolved from the needs of the industry."

Customers wanted a simple user interface and process control capability. The 8000's on-screen programming assistance allows "point-and-click" selection of bond placement sites. A true Windows programming environment provides an operator with instant familiarity and easy navigation. The user interface features "cut and paste" programming along with drop-down menus, toolbars, and wizards that make this system easy to learn and use. Also offered on this platform are SPC software tools that allow the user to monitor and display critical process parameters.

The 8000's larger work area enables higher throughput. The Model 8000 offers 72 square inches (450 square cm), enabling more devices in the bond envelope and improving throughput by eliminating index time.

The bonder's compact footprint conserves precious cleanroom space. The SMEMA-compatible, compact design, 1180 sq. inch (0.76 m sq.), allows for an efficient cleanroom layout, whether the machine is a stand-alone system or integrated into a full production line.

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