Palomar Technologies intros new wire bonder

July 18, 2003
18 July 2003 Vista, CA Lightwave -- Palomar Technologies has introduced the Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12x6-inch (300x150 mm) X-Y bond area, it can handle large hybrids, multichip modules, or several smaller devices at one time. The bonder is capable of placing eight wires per second with a table repeatability of better than ± 5 microns.

18 July 2003 Vista, CA Lightwave -- Palomar Technologies has introduced the Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12x6-inch (300x150 mm) X-Y bond area, it can handle large hybrids, multichip modules, or several smaller devices at one time. The bonder is capable of placing eight wires per second with a table repeatability of better than ± 5 microns.

A combination of the Cognex 8000 vision system and dual-source programmable LED lighting also facilitates accurate targeting and placement. This level of positioning accuracy, along with highly repeatable ball formation, enables tight spacing between wires. Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications.

"We threw out any pre-conceived notions and asked our customers and wire bonding process engineers what they considered to be an ideal wire bonder," said Jerry Jordan, product marketing manager at Palomar Technologies. "Many of the features of the 8000 bonder evolved from the needs of the industry."

Customers wanted a simple user interface and process control capability. The 8000's on-screen programming assistance allows "point-and-click" selection of bond placement sites. A true Windows programming environment provides an operator with instant familiarity and easy navigation. The user interface features "cut and paste" programming along with drop-down menus, toolbars, and wizards that make this system easy to learn and use. Also offered on this platform are SPC software tools that allow the user to monitor and display critical process parameters.

The 8000's larger work area enables higher throughput. The Model 8000 offers 72 square inches (450 square cm), enabling more devices in the bond envelope and improving throughput by eliminating index time.

The bonder's compact footprint conserves precious cleanroom space. The SMEMA-compatible, compact design, 1180 sq. inch (0.76 m sq.), allows for an efficient cleanroom layout, whether the machine is a stand-alone system or integrated into a full production line.

Sponsored Recommendations

March 10, 2025
The continual movement around artificial intelligence (AI) cluster environments is driving new sales of optical transceiver sales and the adoption of linear pluggable optics (...
Dec. 9, 2024
As we wind down 2024, Lightwave’s latest on-topic eBook will examine the hot topics for 2025. AI is at the top of the minds of optical industry players supporting...
Jan. 30, 2025
With the ongoing drive to support AI and the need for high-speed data center interconnection, the call for higher-speed 800G optical technology is emerging. Initially focused ...
Jan. 15, 2025
In this webinar, Juniper Networks, EXFO and Precision Optical Technologies are teaming up to showcase the new 100ZR QSFP28 pluggable coherent technology, exploring its foundational...