IPG releases EDFA for RFoG networks

March 20, 2009
MARCH 20, 2009 -- IPG Photonics says its two-way EDFA with integrated WDM reduces space and cost in radio-frequency-over-glass networks.

MARCH 20, 2009 -- IPG Photonics Corp. (search Lightwave for IPG Photonics), a provider of fiber amplifiers, has announced a new two-way erbium-doped fiber amplifier (EDFA) for radio frequency over glass (RFoG) networks. Building on IPG's multiport EDFAs, the new two-way devices support upstream RF transport through the addition of a fourth wavelength to the current three-wavelength multiport, integrated WDM EDFA design within the same physical package.

IPG says operators of two-way RF optical networks can reduce costs by eliminating RF receiving, combining, and upstream transmission equipment, and decrease space requirements because the EDFA's small form factor (1 and 2 RU) enables deployment of RFoG in smaller outside-plant enclosures. According to the company, users CMTS port utilization is increased by enabling the cascading of multiple two-way EDFAs. The EDFA's flattened L-band gain supports future DWDM additions to today's network deployments. Customers can select the upstream wavelength, including 1,590 or 1,610 nm.

Passive optical networks and other FTTH technologies essentially eliminate the physical bandwidth bottleneck connecting voice, data, and video subscribers to the core network. The Society of Cable Television Engineers (SCTE) is developing a set of standards, collectively called Radio Frequency over Glass, that specify the requirements to support two-way RF delivery over FTTH networks.

RFoG enables the telco operator to build competitive networks supporting the widely deployed SCM-based video services and enables the cable operator to build FTTH networks today, yet continue to provide existing services with the existing RF infrastructure, while enabling bandwidth upgrades in the future.

IPG Photonics Corporation will be presenting the new two-way EDFA in Booth #727 at OFC/NFOEC, held at the San Diego, CA Convention Center from Mar. 24-26, 2009.


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