The Fujikura 45S revolutionizes fusion splicing with a novel, dual fiber preparation capability. The splicer's newly patented sheath clamp design and dual fiber stripper and cleaver enable users to simultaneously prepare both fibers, decreasing turn-up times in activation. Its automated sheath clamp opening and fast tube heater further reduce splicing cycle time, ensuring speedy, easy operation.

The FX120 is the only all-in-one advanced PON analyzer with a native RJ45 port and SFP+ cage to support Layer 4+ testing and ONU Emulation. Ideal for service activation, maintenance and construction, it’s one touch button allows technicians to switch between PON networks such as GPON, XG(S)-PON, EPON and 10G EPON. Certify customer QoE using optional Speed Test and V-PERF for speeds up to 10 Gbps.

From being the industry’s first to one of the most complete OTDR’s, the RXT-4113+ is the only tunable OTDR for DWDM and Legacy 1310/1550//Live1625 nm in a single test module. It supports testing both xWDM, Grey optics and PON networks. Precise wavelength tuning and up to 500,000 data points provides unprecedented network characterization. Often copied, never matched both in features and price.

Smaller size, bigger impact! HFCL’s IBR microcables transform communication with their revolutionary design. Intermittent bonding unlocks faster installation speeds, unmatched ribbon cable packing density, and efficient use of scarce duct space for your network.

Senko's SN-MT Uniboot connector accommodates 124 fibers in a single pluggable interface. This breakthrough allows data center operators to expedite infrastructure deployment four times compared to legacy MPO connectors. The SN-MT enhances installation speed, and its compact design maximizes density, enabling customers to achieve their objectives swiftly, reduce operational expenses, and unlock new revenue sources.

TeraVERSE is a detachable fiber connector to silicon photonic chips for co-package optics applications. It connects 32+ fibers at 127µm pitch for ultimate bandwidth performance with its wideband surface coupling and excellent Insertion Loss performance. Powered by Teramount’s “Self-aligning Optics”, TeraVERSE offers full passive detachable, serviceable and testable connectivity for CPO.

With the demands of generative AI and HPC seeing compute intensity double every six to 10 months, cutting-edge GPU/ASIC packages may soon reach power levels of 50kW+. BERGQUIST® HI FLOW THF 5000UT is a new award-winning thin bond line, low pressure, phase change TIM that limits stress on high-value, high-power density devices while enabling exceptional heat dissipation.