Fiber Optic Center unveils low-stress, low-outgassing epoxy

Jan. 29, 2010
JANUARY 29, 2010 -- Fiber Optic Center Inc. (FOC) has introduced AngstromBond AB9320, a two-part, low-stress blue epoxy that the company says will not cause fiber core cracking or pistoning.

JANUARY 29, 2010 -- Fiber Optic Center Inc. (FOC) has introduced AngstromBond AB9320, a two-part, low-stress blue epoxy that the company says will not cause fiber core cracking or pistoning. While designed for terminating multimode and multi-fiber connectors, it also works well with singlemode and other specialty connectors, FOC asserts.

The heat-cured product has a 60- to 90-minute working time, which FOC points out is "signficantly longer" than the standard adhesives used for multimode and multi-fiber terminations.

The AngstromBond AB9320 is a low-viscosity system that can be cured as quickly as 10 minutes at 100 degrees C. FOC says it's low-outgassing properties enable the adhesive to pass NASA outgassing requirements.

The glass transitiion temperature epoxy is designed to produce a very high bond strength to glass, ceramic, metals, and most plastics.

Visit Fiber Optic Center

Sponsored Recommendations

Coherent Routing and Optical Transport – Getting Under the Covers

April 11, 2024
Join us as we delve into the symbiotic relationship between IPoDWDM and cutting-edge optical transport innovations, revolutionizing the landscape of data transmission.

Supporting 5G with Fiber

April 12, 2023
Network operators continue their 5G coverage expansion – which means they also continue to roll out fiber to support such initiatives. The articles in this Lightwave On Topic ...

Advancing Data Center Interconnect

July 31, 2023
Large and hyperscale data center operators are seeing utility in Data Center Interconnect (DCI) to expand their layer two or local area networks across data centers. But the methods...

Scaling Moore’s Law and The Role of Integrated Photonics

April 8, 2024
Intel presents its perspective on how photonic integration can enable similar performance scaling as Moore’s Law for package I/O with higher data throughput and lower energy consumption...