Enablence ships 120G photonic integrated circuits

July 20, 2010
JULY 20, 2010 -- Enablence Technologies Inc. (TSX-V: ENA) says its advanced photonic integrated circuit (PIC) technology and products to a global Tier 1 customer for that customer’s next-generation metro optical transport network system; built to accommodate bandwidth-heavy services at a lower cost and footprint for network operators.

JULY 20, 2010 -- Enablence Technologies Inc. (TSX-V: ENA) says its advanced photonic integrated circuit (PIC) technology and products to a global Tier 1 customer for that customer’s next-generation metro optical transport network system; built to accommodate bandwidth-heavy services at a lower cost and footprint for network operators.

The customer, whom Enablence declined to identify, will use the PICs to achieve up to 120-Gbps capacity per card while reducing power consumption and space requirements, Enablence asserts.

Enablence’s PIC technology is based on its proprietary planar lightwave circuitry (PLC) approach, which integrates multiple high-speed components into a single optical chip to reduce footprint and costs. This highly integrated PIC technology includes more than 15 layers of wafer processing, which has reduced hundreds of optical parts into one single chip, Enablence says.

“While we continue to grow our FTTH business around the globe, our PIC success demonstrates that our Optical Components and Subsystems Division continues to set the standard for optical transport and photonic integration with new innovations developed on our PLC platform,” said Tim Thorsteinson, CEO of Enablence. “We value the confidence that this customer and other leading network and equipment designers around the world continue to express in our technology.”

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