MACOM intros chipset for short-reach VCSEL-based 100-Gbps onboard optics

MACOM Technology Solutions announced its latest chipset optimized for onboard 100-Gbps optical transceivers at ECOC 2016. The MALD-37345, a VCSEL driver with input equalizer, and the MATA-37344, a quad 28G transimpedance amplifier, combine for a complete transmit/receive approach targeted for short-reach VCSEL-based 100G onboard optics. The devices also are suited for optical modules and active optical cable applications, MACOM says.

MACOM Technology Solutions announced its latest chipset optimized for onboard 100-Gbps optical transceivers at ECOC 2016. The MALD-37345, a VCSEL driver with input equalizer, and the MATA-37344, a quad 28G transimpedance amplifier, combine for a complete transmit/receive approach targeted for short-reach VCSEL-based 100G onboard optics. The devices also are suited for optical modules and active optical cable applications, MACOM says.

The new chipset eliminates the need for clock data recovery (CDR) and is backwards pin compatible with MACOM's currently shipping MALD-37045 and MATA-37044 devices. This enables customers to mix and match parts to include or not include a CDR for flexibility.

"By eliminating the need for the clock and data recovery circuitry present in its predecessors, this chipset enables our customers to deliver ultra-low power and low-cost transceivers that can be placed close to host ASICs for intra-system optical connectivity," says Marek Tlalka, director of product marketing at MACOM.

The MALD-37345 includes programmable eye-shaping features. The MATA-37344 TIA features selectable bandwidth to support up to 28.05 Gbps and lower speed legacy data rates, as well as an output driver with programmable output swing and two-tap de-emphasis.

"Increasing data rates on the PCBs creates signal integrity and thermal constraints due to concentration on the optical input/output at the front panel," says Simon Stanley, founder and principle consultant at Earlswood Marketing Ltd. and analyst-at-large with Heavy Reading. "By placing a transceiver close to the host ASIC, these constraints are alleviated."

Both devices are available in 2x3-mm die form, supplied in waffle packs, whole wafers, or quartered wafers.

For related articles, visit the Optical Technologies Topic Center.

For more information on optical semiconductors and suppliers, visit the Lightwave Buyer's Guide.

More in Electronics