FEBRUARY 22, 2008 -- Cortina Systems (search for Cortina) has announced the CS4212 and CS4217 electronic dispersion compensation (EDC) chips. The CS4212 and CS4217 are designed to enable 10GbE enterprise, metro, and core market segments across all form factors through their size, low power, and availability.
Cortina says its CS4212 enables the industry's move to SFP+ by increasing multimode fiber reach to more than 300 meters. This allows a single board design for all SFP+ module types and also makes possible higher-density line cards due to the low power and small footprint.
Cortina's CS4217 enables optical module suppliers to build devices compliant with the 10GBASE-LRM standard. The low power and small footprint allow X2 and XFP modules to be built for legacy multimode fiber applications in the enterprise, the company says.
"SFP+ has the potential to reduce the 10G overall systems cost and drive 10GbE to volume shipments," said Scott Feller, product line manager at Cortina Systems. "Cortina is seeing the market take off with the CS4212 and CS4217 shipping more than 40,000 ports in the first quarter of this year."
The Cortina Systems CS4212 Electronic Dispersion Compensation Device is integrated with four 10-Gbit/sec clock and data recovery (CDR) circuits. Two channels have the optional capability for integrated EDC. This functionality supports two SFP+ modules that can be either limited or linear. Enabling the EDC capability allows the device to operate with linear SFP+ optical modules to extend the operating range of 62.5- and 50-micron multimode fiber to 300 m and beyond, the company asserts. The device is fully autonomous and does not require external processors to control the initial convergence or the dynamic adaption of the dispersion compensation.
The Cortina Systems CS4217 Electronic Dispersion Compensation Device is a dual-port 10-Gbit/sec CDR circuit. The receive path has integrated EDC to allow optical modules to extend the operating range of 62.5- and 50-micron multimode fiber to at least 300 m. The device comes in a 6x6-mm package to allow easy integration in to optical modules. The device integration and low power design techniques allow XFP 10GBASE-LRM modules to be built under 1.5 W, Cortina says.
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