Vitesse delivers second-generation EDC chip
DECEMBER 12, 2007 -- Vitesse Semiconductor Corp. has released of the next-generation of its dual CDR ICs with integrated EDC, the VSC8240 and VSC8242.
DECEMBER 12, 2007 -- Vitesse Semiconductor Corp. (search for Vitesse) has released of the next-generation of its dual clock and data recovery (CDR) ICs with integrated electronic dispersion compensation (EDC), the VSC8240 and VSC8242. Devices offering EDC enable 10-Gigabit Ethernet (10GbE) implementations across multiple applications in enterprise, metro, and core networks including those using SFP+ and XFP optical modules, 10G NICs, 10G copper interconnects, and 10G copper backplanes.
These new, low-power EDC devices evolve from Vitesse's first-generation EDC technology, the VSC8238, which was very successful during the first round of 10GBase-LRM X2 design ins. According to Tony Conoscenti, vice president, product marketing for Vitesse, "Vitesse has shipped 50,000 ports of VSC8238 for 10GbE applications. Now, we have moved our EDC technology into lower-power CMOS. This new product doubles the integration and reduces power consumption by 50 percent. It will substantially reduce the cost of deployment of 10GbE across the optical enterprise and metro service transport networks."
Lower cost, lower power, and higher port densities are driving SFP+ to become the predominant optical module format for new platforms. The lead application for the VSC8242 is enabling the migration of datacom and telecom routers and switches to the SFP+ optical module form factor. Three SFP+ reach applications have been standardized for 10GbE networks: 10GBASE-SR, -LR and -LRM. The VSC8242 is designed to support all three applications in compliance with IEEE standards 802.3aq, 802.3ae, and SFF-8431 electrical specifications.
The VSC8242 incorporates two bi-directional 10-Gbit/sec paths to support the increased port densities. Additional features of the VSC8242 include various lookbacks a set of programmable Rx and Tx path functionality, such as output pre-emphasis, and full 1 GbE data rate support. Packaged in a 12x12-mm flip-chip CSP package, the VSC8242 has an integrated microcontroller to enable auto adapation of dispersed optical signals. Typical power dissipation is 750 mW for each bi-direction channel.
Vitesse says it has successfully performed interoperability testing of the VSC8242 with SFP+ optical modules from "leading vendors" with coverage for SR, LR, and LRM applications. Fully autonomous convergence code has been released to Vitesse's enterprise customers and module partners, the company adds.
A single-channel variant, the VSC8240, is also available in an 8x8-mm flip-chip CSP package. The VSC8240 has all of the functionality of the VSC8242, but is targeted at XFP CDR and other single receive path applications such as singlemode fiber reach extension applications in metro and long-haul transport systems. The VSC8240 compensates for both SMF chromatic dispersion (up to 2400 psec/nm) and polarization-mode dispersion (over 70 psec differential-group delay) in a poor OSNR environment and will enable the adoption of 120-km, 160-km, and longer applications.
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