TE Connectivity offers microQSFP interconnects for data center networks

July 28, 2016
TE Connectivity is first out of the gate with an interconnect family designed to the Micro Quad Small Form-Factor Pluggable (microQSFP) multi-source agreement (MSA). The fact that the company is the first to market with microQSFP technology isn't a surprise, as it was the module vendor most responsible for creating the MSA in the first place (see "TE Connectivity seeks partners for new 100G optical transceiver MSA").

TE Connectivity is first out of the gate with an interconnect family designed to the Micro Quad Small Form-Factor Pluggable (microQSFP) multi-source agreement (MSA). The fact that the company is the first to market with microQSFP technology isn't a surprise, as it was the module vendor most responsible for creating the MSA in the first place (see "TE Connectivity seeks partners for new 100G optical transceiver MSA").

As the name implies, the microQSFP form factor aims to provide improved faceplate density versus a QSFP package. The microQSFP offers the same functionality as a QSFP28, but in what TE describes as a "generally SFP-sized form factor" that enables 33% higher faceplate density. The use of microQSFPs can enable 1RU line cards with 72 ports of 100 Gbps, according to Phil Gilchrist, CTO, TE Data and Devices.

The form factor also offers better thermal performance and improved electrical performance at 25 Gbps, the company asserts.

The new microQSFP products support 56-Gbps performance with backward compatibility to 28 Gbps to support next-generation designs. Built-in fins on the devices eliminate the need for additional clips and heatsinks and enable faceplate airflow to the interior of the equipment, TE points out.

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