New Products


Photonic integrated platform
The HyBoard hybrid photonic integrated circuit (PIC) platform enables systems integrators to offer high–performance, highly functional, custom PICs at telecom production volumes. The platform provides assembly and form–factor advantages over traditional multiple gold box alternatives and delivers a degree of flexibility, performance, and functionality that is not possible with full monolithic integration, claims the company. HyBoard brings together three main elements: InP active/passive optoelectronic device arrays, singlemode planar silica waveguides, and micromachined silica submounts. The platform can be extended to accommodate optical isolators, thin–film filters, and polarisation elements, as well as customisable channel spacings and a wide range of different active/passive component arrays.
CIP Technologies,

The HMC690 transimpedance amplifier (TIA) chip is designed for driving optical systems transceivers directly. The device supports data rates up to 11.3 Gbits/sec and meets the requirements of SONET OC–192/SDH STM–64, 10GbE, and 10–Gbit/sec systems deploying optical amplifiers. The TIA provides a differential output voltage that is proportional to the applied current at its input port, which is typically supplied by a photodiode. Operating from a single +3.3–V supply, the HMC690 features low input referred noise of 11 pA/vHz, provides an RSSI output for monitoring average input power, and is designed for driving a typical transceiver or clock and data recovery circuit (CDR) directly. The device also features a DC offset control, which enables output signal level adjustment for asymmetric signals. Additional features include an integrated 300–ohm resistor for photodiode supply voltage and an extended linear range option. The HMC690 die is specified for operation over the –40ºC to +85ºC temperature range.
Hittite Microwave,

The high–performance DQPSK demodulator is the newest addition to the company's 40–Gbit component family. This 40Ã�35Ã�8.5–mm device is based on the company's patented Free Space Micro Optics Block (FSMOB) technology. It features insertion loss of 5 dB; free spectral range of 21.5, 25, and 32.5 GHz; isolation of >16 dB; PMD of 0.1 psec; and return loss of 40 dB. Operating temperature is –5~+65°C, and storage temperature is –40~+80°C.
Photop Technologies,

A new generation of high–power collimated laser modules targets customers in need of high–brightness laser sources with low beam divergence. Featuring fast axis collimation and a compact package design, the collimated laser modules come in two types: fixed collimation optics, preset to meet customers' application requirements in terms of beam divergence or spot size; and adjustable collimation optics, enabling the end user to fine–tune the laser output for the optimal beam shape required by the application. The modules are built around the 9–mm TO–can package.

The CWDM–SFP+ transceiver module can provide parallel transmission at 80 Gbits/sec. This 10–Gbit/sec CWDM SFP+ module is MSA–compatible and allows up to 48 ports per line card. The internal DFB LD chip achieves lower reduced parasitic capacitance than the existing one, according to company claims. The module covers a center wavelength from 1470 to 1610 nm with 20–nm spacing. Since transmission distance is less than 10 km, power penalty due to chromatic dispersion can be negligible. The device will be launched in 2009.
Sumitomo Electric Industries Ltd.,

New 980–nm cooled terrestrial pump laser modules use standard singlemode fibre pigtails. These new Ultra–High Output Power Pump Modules incorporate the company's 1999 LCv2 laser chip, designed and produced internally and fully qualified for submarine applications. Key features include a maximum operating drive current of 1050 mA for a 680–mW operation power; up to 750–mW kink–free fibre–coupled output power from â��5°C to +75°C; low–profile hermetically sealed 14–pin butterfly package with standard SMF pigtail; fiber Bragg grating stabilization; multiple wavelength availability; integrated thermo–electric cooler, NTC thermistor; and back–facet monitor photodiode. The devices are fully qualified in accordance with Telcordia GR–468–CORE specifications and RoHS 6/6–compliant.

FTTH gateway
The Gigabit FTTH gateway provides a connection of 1000 Mbits/sec for triple–play services, including broadband internet, HDTV, IPTV, telephony, and more. The gateway is fully compliant with industry standards such as IEEE 1000Base–BX10 and 802.3ah and is designed to be used in open access networks in which multiple service providers deliver their services over a single fibre infrastructure. The unit offers multi–services broadband, simple but powerful network management, ease of installation, and the possibility to install the passive fibre network first and install the active part of the CPE at a later stage, claims the company. The device comes with four Active Ethernet ports that can be individually provisioned and managed and can be used for data, IPTV, HDTV, and VoIP. Options are two analogue voice ports as well as a CATV port.
Genexis B.V.,

Coarse Wavelength Division Multiplexing (CWDM) and Optical Add/Drop Multiplexer (OADM) products are now part of the company's MEF–certified iConverter product family. These new modules install in any iConverter chassis alongside other iConverter products, occupy a minimal amount of rack space, and provide some of the highest port densities in the industry, claims the company. The modules are available in expandable four–channel and eight–channel configurations, with a full complement of added features and functions. They can be installed in new or existing networks with other iConverter system components. Up to 19 four–channel modules (76 ports) can be installed in a 2U–high equipment rack. Alternatively, up to nine eight–channel modules (72 ports) can occupy the same area. The units are completely passive and require no external power. Optional features include a tap/maintenance port that facilitates troubleshooting and monitoring, and 1310–nm channel pass–through technology, which allows a wide range of CWDM wavelengths to be added to existing 1310–nm SONET/SDH rings without affecting existing services.
Omnitron Systems Technology, www.omnitron–

Photonic design automation
VPItransmissionMaker Optical Systems software for optical systems design addresses the convergence of optical technologies and architectures for access, aggregation, and core networks. To support quick assessment of signal quality measures in WDM transmission systems using built–in or user–supplied engineering design rules, Version 8.0 provides the new VPIdesignRules Control, which takes advantage of link analysis capabilities. Version 8.0 also offers enhanced modeling capabilities for optical transmitter and receiver components needed in high–speed mPSK, mQAM systems, and OFDM transmission systems.
VPIsystems Inc.,

EP30 epoxy adhesive for high–performance bonding applications features very low viscosity along with chemical resistance, dimensional stability, hardness, and good optical clarity, claims the company. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements. For medical applications, a USP Class VI approved version called EP30MED is also available. The adhesive adheres to a variety of substrates, including metals, ceramics, glass, and many plastics. Typically, the lap shear strength exceeds 3,000 psi for aluminum–to–aluminum bonds. EP30 also has low shrinkage upon cure. It is suitable for assemblies where only very thin bond lines are dictated by design considerations. The adhesive is available in 1/2 pint, pint, quart, gallon, and five–gallon kits, as well as in gun applicators and double–pouch divider packs.
Master Bond Inc.,

The UltraSpan family of amplification equipment addresses the challenges of ultra–long repeaterless links and long spans within multi–span links. The UltraSpan products can be used individually or in any combination to extend the span reach of existing system designs. It supports ultra–long point–to–point repeaterless links of up to 70 dB using standard transponders (corresponding to about 350 km) as well as long spans that are part of a multi–span network. The UltraSpan suite is used for enterprise SANs, disaster recovery, and security sensitive networks. Four complementary products are included in the suite: The UltraSpan Raman, which provides up to 1.2 W of co– or counter–propagating Raman pump power; the UltraSpan Power Booster, which provides up to 26 dBm of launch power; the UltraSpan ROPA, which provides up to 1.2 W of combined counter–propagating Raman pump power and 1480–nm pump power for remote EDF pumping; and the UltraSpan Submarine Terminal, a modular EDFA/Raman/ROPA unit designed for stringent low FIT (very high reliability) network applications.
RED–C Optical Networks Ltd.,–

Small–form–factor transponders
Tunable SFF 10G 300–pin MSA transponders are available in two models, using either a lithium niobate or indium phosphide modulator. The transponders can be used with the company's Free–Path family of manageable dispersion compensation modules as a complete optical transmission approach for any distance. The units are designed for long–reach DWDM applications and contain a 10–Gbit/sec widely tunable transmitter covering the entire C–Band and a wideband receiver. The transponders support transmission distances of up to 80 km.

Optical Media Converter (OMC) products have been added to the company's InterBOARD line of parallel optical modules and active optical cables (AOC) for high–density interconnections between printed circuit boards and systems. Designed for very short reach (VSR) applications of up to 300 m, the four–port, hot–pluggable OMC modules and AOCs provide full–duplex, four–channel electrical connectivity using multimode optical fiber. The first products available will operate at an aggregate bandwidth of up to 12.5 Gbits/sec (four channels at 3.125 Gbits/sec for XAUI support). The two OMC units, which are designed to support high–performance computing (HPC), telecommunications, and data communications equipment, offer direct support for 10 Gigabit Ethernet CX–4, Fibre Channel, and InfiniBand. Upcoming versions will feature channel speeds up to 10 Gbits/sec.
Reflex Photonics,

The ExpressLight WSS features 3–dB loss and is integrated with optical channel monitoring and channel equalization functions in a small–form–factor 1RU shelf. The ExpressLight WSS has been developed as a core component of a carrier ROADM strategy, providing the ability to remotely reconfigure any or all wavelengths. It offers up to 50% the loss of competing technologies, according to the company, at less than 3 dB of express or drop loss. Operators can manage up to 42 wavelengths at 100–GHz channel spacing, provide colourless and hitless add/drops, and manage the network through the integrated channel monitoring and equalization capabilities of the shelf. The combined ultra–low loss, wide passband, and high OSNR ensure maximum ability to cascade network nodes. The first ExpressLight WSS product is available in a passively cooled shelf, offered as a 1Ã�9 configuration (one common line, nine add or nine drop paths). The core technology is scalable and will allow for 1Ã�5 through 1Ã�20 configurations.

The six–channel "Adder" Optical Multiplexer–Demultiplexer (PN 147–7L01–SA) works with its four–channel counterpart to support up to 10 CWDM channels using a single fiber for 75–km, full–duplex links. By installing the four–channel 147–4L01–SA first, the MSO can initially deploy the most widely used ITU wavelengthsâ��1551 nm, 1531 nm, 1511 nm, and 1491 nmâ��and then add others when necessary. Small quantity pricing for model 147–7L01–SA is $960; model 147–4L01–SA is $640.
Optical Zonu Corp.,

Utilizing fibre Bragg grating capabilities, this tunable dispersion compensation module (TDCM) is also colourless, allowing operators to set any wavelength across the entire C–Band. Ideal for DWDM 40G applications, the TDCM tightly controls dispersion with continuous tunability from –700 to +700 psec/nm. Integrated control electronics simplify implementation and remove the need for external calibration tables and driver circuits. The TDCM can also be used as an in–line compensator in 10G systems, where it compensates for all ITU channels and replaces a number of fixed DCMs.
Proximion Fiber Systems AB,

The ultra–compact small–form–factor amplifier gain block measures 70Ã�40Ã�7.5 mm and represents a 72% volume reduction compared to the MSA standard amplifier gain block, according to company claims. The MiNi Block µ7040 is being sampled to customers and will be generally available in Q4 2008. The MiNi Block µ7040 amplifier gain block is primarily targeted at 40–Gbit/sec transport systems in which low–noise optical amplification is required for each channel before the 40–Gbit/sec receiver and space is at a premium. Due to its low height of 7.5 mm and small footprint, the amplifier can also support 40–Gbit/sec transponder designers looking to integrate optical amplifiers into the standard transponder footprint. The unit offers output power of up to 15 dBm and produces about 1.2–W thermal dissipation. The product uses standard components, including telecoms–grade 125–µm fibre, features the de–facto industry standard 12–way electrical connector, and is available in semi–custom variants.
Bookham Inc.,

An extension of the company's DPSK product line to support L–Band (1570.42– to 1607.42–nm) wavelengths enables 40–Gbit/sec wavelengths to plug and play in 10–Gbit networks to increase usable bandwidth and meet the demand for higher line rate services. The L–Band product line includes:

  • OTS–4040–L DPSK: a full standard (OTU3, OC–768/STM–256) compliant 40–Gbit/sec client and line transponder
  • OTS–4011–L DPSK: a standard (OTU3, OC–768/STM–256, OTU2, OC–192/STM–64 10GbE LAN/WAN) compliant 4Ã�10–Gbit/sec to 40–Gbit/sec multiplexing transponder (muxponder)
  • OTS–4400–L DPSK: a unidirectional 40–Gbit/sec regenerator to further extend the reach of both of the above products.

StrataLight Communications Inc.,
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