WEBINAR

Enabling the AI Era: High-Density Interconnects for CPO and NPO

Discover how leading innovators are redefining data center design with co-packaged optics (CPO) and near-packaged optics (NPO). Join experts from Accelink, TE Connectivity, and US Conec as they reveal the technologies powering scalable, energy-efficient infrastructure for the AI era.

December 04, 2025

4:00 PM UTC

1 hour

Sponsored by

December 4th, 2025

Time: 11:00 AM ET | 10:00 AM CT | 8:00 AM PT

Duration: 60 minutes

Already registered? Click here to login now.

Summary

As AI systems continue to expand in scale and bandwidth, interconnect density has become one of the biggest challenges in data center design. Co-packaged and near-packaged optics (CPO/NPO) architectures are emerging to meet these demands, integrating optical and electrical connectivity closer to the switch ASIC.

In this joint webinar, experts from Accelink, TE Connectivity, and US Conec will share their perspectives on the technologies enabling this evolution — from optical engines and External Laser Small Form Factor Pluggable (ELSFP) connectors to high-density electrical and fiber interconnects.

The session will explore how these innovations together are driving scalable, energy-efficient infrastructure for the AI era.

Speakers

Tiger Ninomiya

Principal Technologist

Accelink USA Corporation

Tiger Ninomiya is currently a Principal Technologist at Accelink USA Corporation, where he actively engages with Accelink’s latest technologies, including optical transceivers for datacom and telecom, as well as other optical components, modules, and subsystems. With over 12 years of experience in fiber optics, telecom, and datacom, he actively participates in standard groups and industry consortia, such as IEC, OIF, IEEE, ITU-T, and MSAs such as QSFP-DD, SFP-DD, OSFP, and LPO. He has held leadership roles in organizations such as IEC, TIA, and COBO. In the past, Tiger was heavily involved in the development and standardization of VSFF fiber optic connectors.

Tom Mitcheltree

Advanced Technology Manager

US Conec

Tom Mitcheltree has over 25 years of experience supporting high density optical links. His current focus is developing next-generation solutions for AI scale-up & scale-out, including blind mate and expanded beam connectivity. Tom is a participating member of IEEE, OIF, and multiple transceiver MSAs. He has been a contributing expert to IEC and TIA standards, including authoring FOCIS 5 &18.

Nathan Tracy

Technologist, System Architecture Team

TE Connectivity

Nathan Tracy is a Technologist on the system architecture team for TE Connectivity’s Digital Data Networks business unit, where he is responsible for driving standards activities, providing input on new technology requirements, and working with key customers to enable system architectures. Nathan has more than 30 years of experience in technology development, marketing, and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets. Nathan is active in several industry standards and associations. He currently serves the OIF as President and is a regular attendee and contributor to IEEE 802.3, and Ethernet Alliance. Additionally, he is active in a number of industry MSAs and forums where he has held leadership roles. Nathan earned his Bachelor of Science Electrical Engineering Technology degree from the University of Massachusetts, Dartmouth.