Intelligent manufacturing solutions for advanced CPO, LPO, NPO & OCS

March 4th, 2026

1:00 PM ET / 12:00 PM CT / 10:00 AM PT / 5:00 PM GMT

Duration: 1 hour 

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A certificate of attendance will be offered. 

Summary 

Recent developments in AI capability have radically altered global data center strategy, changing every aspect of the pathway forward – GPU connectivity bandwidth and latency, acceleration of infrastructure upgrade cycles, hyperscaling strategies, and increased focus on energy efficiency for high-performance compute in general. While we must acknowledge that integrated optoelectronics and photonics has already been making steady progress towards data center implementation over the last decade, the AI boom presents a huge delta change in the opportunity for silicon photonics, or SiPh-enabled devices (aka CPO) in these types of applications.

Whereas general photonics assembly and test is already a well-established skill set even at volume, SiPh presents its own particular set of challenges – in particular when considering some of the pipelined optical engine designs for future CPO iterations. One of the greatest challenges thus facing successful SiPh implementation is the high-volume manufacturing required to meet demand projections for CPO, LPO, NPO & OCS. Any appropriate solution must be foundry-capable and meet the expectations of an industry long accustomed to well-established semiconductor practices, including readiness, reliability, available capacity, and scalability.

While ficonTEC is a well-recognized leader for manufacturing solutions for photonics, it is the sole provider of intelligent and scalable assembly & test solutions that cover the entire SiPh device production chain – from wafer-level processes to assembled device module. This webinar will introduce these capabilities and present the viewer with a real-world pathway to full SiPh industrialization.