Co-Packaged Optics Status Check

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Co-packaged optics continue to advance as the industry searches for new ways to overcome the bandwidth, power consumption, and interconnect limitations associated with rapidly scaling AI and high-performance computing infrastructure. While much of the initial discussion has focused on integrating optical connectivity with high-capacity Ethernet switches, the potential applications for CPO are expanding.  

As AI clusters grow, accelerator interconnect requirements intensify, and conventional electrical connections approach practical limits, the industry is examining where moving optics closer to processing and switching silicon can deliver meaningful advantages. These developments are opening conversations around scale-up and scale-out AI networks, high-performance computing systems, advanced optical I/O, and emerging compute architectures. Yet significant questions remain. How mature are today's CPO technologies? Which applications offer the most compelling initial deployment opportunities? What progress has been made in optical engines, fiber connectivity, packaging, thermal management, testing, and serviceability? And perhaps most importantly, what will it take to move from successful demonstrations to commercially viable deployments?

This editorial webinar will bring together industry experts to examine the current state of co-packaged optics, the technical and economic challenges still facing adoption, and the applications most likely to drive early commercial momentum.