Actelis says Ethernet access device offers mobile backhaul alternative

May 9, 2012
Actelis Networks says it will show off a new Ethernet Access Device (EAD) for mobile backhaul applications at the International CTIA Wireless Expo in New Orleans. The EAD provides a more economical and efficient approach to providing mobile backhaul services for networks using picocells or other small cells.

Actelis Networks says it will show off a new Ethernet Access Device (EAD) for mobile backhaul applications at the International CTIA Wireless Expo in New Orleans. The EAD provides a more economical and efficient approach to providing mobile backhaul services for networks using picocells or other small cells.

The company says that operators traditionally have chosen among three options when looking in increase mobile backhaul capacity: add fiber, bond multiple T1/E1 lines, or deploy microwave link equipment. However, depending upon the circumstances, each of these options may be flawed. Fiber deployments may not be economical in less densely populated urban and rural areas, for example. Bonding T1/E1 lines also is not an economically sustainable or scalable strategy. And microwave links may not adequately ensure quality of experience, since line-of-sight is required to function properly.

Instead of these options, Actelis promotes Ethernet over copper via Ethernet in the First Mile (EFM) technologies.

"Adoption of mobile applications and underlying wireless services is expanding at an unprecedented rate, and customers are relying on services that deliver the experience they expect," said Joe Manuele, executive vice president of worldwide sales and customer support. "This network overloading, coupled with significant growth in wireless traffic and customer expectations to have high-quality, 24/7 wireless service regardless of their location, is fueling broadband Ethernet over copper backhaul adoption, especially for small cell wireless applications, because they are more efficient, cost-effective and carriers can deploy them immediately."

The new Actelis ML700 EAD is designed to help wireless service providers implement such Ethernet over copper links. The EADS are the first and only line such devices that can support up to 500Mbps of bandwidth with extended reach using standard EFM bonding via DMT technology, Actelis asserts.

Actelis quotes Michael Howard, principal analyst and co-founder at Infonetics Research, as believing that while carriers will use a mix of mobile backhaul technologies, EFM over copper will play a major role.

"We expect operators to spend $1.5 billion on EFM bonded copper Ethernet Access Devices in the next five years, as they increase the capacity to improve efficiency of mobile backhaul networks and business connections," stated Howard in an Actelis press release. "It's clear that growing numbers of service providers globally are becoming comfortable with EFM technology, and are taking advantage of its extended reach and capacity on copper in many applications and locations where fiber is too expensive for the return on investment."

For more information on high-speed transmission systems and suppliers, visit the Lightwave Buyers Guide.

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