Broadband Technology Report and sister site Lightwave will co-produce a virtual event this month under the theme “High-Speed Networking.” The event will feature a series of webinars with a variety of industry experts, to be presented from September 21-29.
The event's Day 1 Sessions are described here.
Day 2 of the High-Speed Networking Virtual Event will provide a look at the industry's evolution toward smaller and more modular communications systems, plus tips and tricks for opto-electronic device characterization, and strategies for broadband access deployments.
Specifically, the virtual event's Day 2 Sessions include the following:
Sep. 22, 2020 10:00 AM CDT
Compact modular systems have evolved from custom-made platforms for Internet Content Providers to the mainstream in optical networks. They’re now available for all network operators and useful in a wide range of applications. This session will highlight how compact modular platforms raise the bar of network performance, while lowering capex and opex, delivering enhanced flexibility, and supporting network automation. Our speakers also will touch on the upcoming innovations and enhancements we can expect in such platforms.
Sep. 22, 2020 12:00 PM CDT
Opto-electronic devices have become an integral part of the modern world. They provide almost unlimited bandwidth, low loss, low interference, short- and long-distance coverage, and high-speed data transmission capability to bandwidth-hungry data transmissions and high-speed interconnects. However, application usage is requiring opto-electronics to shrink in size. While this miniaturization allows more opto-electronic or electro-optical devices to be placed on a single wafer, it increases complexity when testing and verifying their performance. As device technologies evolve from simple transmission lines to optical-to-electrical converters to optical modulators and beyond, manufacturers must produce proper platforms that enable chip designers to test and improve their rapidly maturing silicon photonic (SiPh) designs. This webinar will discuss SiPh probing applications, which fall into three categories: modeling and characterization, wafer acceptance testing, and production process monitoring. You will learn more about each of these categories and their unique emphasis relative to accuracy, throughput, and test flexibility.
Sep. 22, 2020 2:00 PM CDT
Data is fast becoming one of the essential infrastructures needed to support a prosperous urban or suburban community, almost the fourth utility. Much like the interstate system when it first arrived, optical fiber and high-speed data are passing alongside small and rural communities without a single connection. Communities have decisions to make regarding how to stay relevant. What are the options? What should be considered to provide better access? We will review some of the planning for access to the community and discuss options to make the physical connection.
All sessions will be available on-demand within 48 hours after their conclusion.
As growing capacity demands are putting pressure on communications networks of all stripes, the High-Speed Networking virtual event comprises a series of 12 webinars that will address networking requirements, options for meeting these requirements, and the development of high-speed networking technology for current and future applications.
The event also offers a library of videos, whitepapers, data sheets, and other information to complement the information provided via the webinars. Registrants can access this content by application or by company.
Applications covered during the virtual event include:
- Broadband networks
- Edge and aggregation networks
- Long-haul, regional, and metro networks
- Data center interconnect
- Data center networks
- Technology development for high-speed networking
- Test, measurement, and monitoring for high-speed networks
Key takeaways for attendees will include:
- Capacity demand drivers and trends
- Options for meeting capacity requirements specific to their application
- What technology is available now and what’s on the way
- How to overcome high-speed technology development challenges
The High-Speed Networking virtual event is backed by 13 leading companies who will sponsor the event. They include:
Platinum Sponsors: Anritsu Co., Calix, Infinera, Inphi, Ribbon Communications, and Source Photonics.
Gold Sponsors: Ciena, HellermanTyton, Intel, Senko Advanced Components, and TVC/Wesco.
Bronze Sponsors: CommScope and Vela.