Agilent Technologies demonstartes interoperability of 10-GbE XENPAK transceiver and XAUI SerDes chips

June 10, 2002
June 10, 2002--Agilent Technologies has successfully demonstrated interoperability between its 10-Gigabit serial Ethernet (GbE) XENPAK optical transceiver and leading XAUI SerDes chips. The products are available through BFi OPTiLAS in Europe.

Agilent Technologies has successfully demonstrated interoperability between its 10-Gigabit serial Ethernet (GbE) XENPAK optical transceiver and leading XAUI SerDes chips. Network equipment manufacturers (NEMs) can now focus on the system level aspects of their design rather than verifying connectivity between the transceiver and SerDes chip, which translates to fewer design iterations and faster time to market, claim company representatives. Agilent's products are available through BFi OPTiLAS in Europe.

Sponsored Recommendations

April 10, 2025
The value of pluggable optics in open-line systems is also becoming more apparent. This webinar describes this trend and explores how such modules can best be employed. Register...
April 25, 2025
This webinar will examine trends and advancements at the system and optical module levels for data center interconnect. Register today to join the discussion.
March 25, 2025
Explore how government initiatives and industry innovations are transforming rural broadband deployments, overcoming cost and logistical challenges to connect underserved areas...
April 11, 2025
Taking a comprehensive approach to developing electronic products is the key to successful outcomes.