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Marvell: Orion 800 Gbps Coherent DSP

Feb. 21, 2024
Marvell's Orion coherent digital signal processor (DSP) enables carriers and clouds to replace traditional transport equipment for better scalability and TCO.
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Point2 Technology: P3A280 Electrical Dispersion Compensation Mixed-Signal SoC

Feb. 21, 2024
Point2 Technology’s P3A280 25G Electrical Dispersion Compensation (EDC) Mixed-Signal SoC integrates a single-channel transceiver with a proprietary electronic dispersion compensation...
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InSiGa: ISG-D5640H 56Gbaud MZ Driver for LPO Solution

Feb. 21, 2024
InSiGa's ISG-D5640 is a quad channel 53Gbaud/s differential input, differential output MZ driver die for 400Gbps applications.
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InSiGa: ISG-2925H 25G CDR+EML&BM LA Combo Chip

Feb. 21, 2024
InSiGa's ISG-C2925H is a 25G CDR+EML&BM LA Combo Chip product designed to meet the requirements of 25G PON.
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Henkel Corporation: Bergquist® Hi Flow THF 5000UT (Thermal Management Material)

Feb. 21, 2024
Henkel’s Bergquist® Hi Flow THF 5000UT is a silicone-free, phase change TIM that delivers thin bond line capability with low-pressure and low thermal impedance for large die processors...