Bookham announces opening of manufacturing facility in Shenzhen, China

March 18, 2004 Oxfordshire, UK -- Bookham Technology plc is preparing to open an advanced manufacturing facility in Shenzhen, China as part of its wider strategy for the Asia Pacific region, where the company has seen revenue growth in the last two years. The factory in Shenzhen was obtained through Bookham's recent acquisition of New Focus Inc.

March 18, 2004 Oxfordshire, UK -- Bookham Technology plc is preparing to open an advanced manufacturing facility in Shenzhen, China as part of its wider strategy for the Asia Pacific region, where the company has seen revenue growth in the last two years. The factory in Shenzhen was obtained through Bookham's recent acquisition of New Focus Inc.

Bookham's plant in Shenzhen covers 250,000 square feet, including state-of-the-art cleanrooms, and will be a key assembly and test facility, say company representatives. The first products to be manufactured in Shenzhen will be Transmitter Optical Assemblies (TOAs) and Receiver Optical Assemblies (ROAs), simple amplifiers, connectors, and fiber assembly.

"Bookham has already demonstrated its ability to relocate product and processes around the world," contends Liam Nagle, president and chief operating officer at Bookham. "We have successfully relocated an indium phosphide (InP) wafer fab facility from Ottawa, Canada, to Caswell, UK, during 2003, six months ahead of schedule, with no impact to our growing customer base. We have a track record of managing change successfully and we will use the same processes and management focus to create and transition the products to Shenzhen, in a similar way to that which we have done over the last two years," he says.

Siak Chiew Lim has already been appointed as vice president of Asia Pacific Operations and is responsible for leading the manufacturing start-up in Shenzhen. Prior to joining Bookham, Lim spent 20 years at Intel where he held a number of senior management positions, including general manager of manufacturing operations in Malaysia, Puerto Rico, and Ireland. Lim also led the manufacturing development of Intel's flip-chip PGA platform in the United States and served as the platform's assembly and test manufacturing chairperson worldwide.

"This is an important time for Bookham Technology," he asserts. "In choosing to open a facility in Shenzhen, Bookham is recognizing the potential within China as well as the greater Asia Pacific region. We are looking to recruit for a range of positions and believe that this will be the start of a long-term relationship that benefits Bookham, Shenzhen, and our customers."

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