Modulight signs distribution agreement for Japan

10 December 2002 -- Tokyo's High-Tech Corp has signed a distribution agreement to sell and promote the optoelectronic epiwafers, chips and packaged components of Finland's Modulight in the Japanese market.

10 December 2002 -- Modulight Inc of Tampere, Finland and High-Tech Corp of Tokyo - a distributor established in 1989 to import optoelectronic components and devices to Japan - have signed a distribution agreement to sell and promote Modulight's products in the Japanese market. Modulight's product portfolio covers optoelectronic epiwafers, chips and packaged components for telecoms.

"High-Tech Corporation has wide coverage in Japan and strong knowledge of optical products and the market segment in general," says Modulight's CEO Dr Petteri Uusimaa.

"We have been focusing on telecom market for more than 14 years," says High-Tech's president Dr T Nakahara. "We will provide optical transmission component solutions to the customer and rapidly submit the feedback from the Japanese market to Modulight."

www.modulight.com

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