Teradyne enters optical interconnect market with a modular platform

26 January 2004 Nashua, NH Lightwave--Teradyne's Connection Systems (TCS) division, today announced its first entry into the optical interconnect market with the HD-Optyx connector. The HD-Optyx connector features a modular architecture, which enables efficient layout, and the flexibility to quickly scale to changing design requirements. Common components can be assembled into custom configurations quickly with no retooling required.

The HD-Optyx connector is the only one of its kind today that works with both high density MT ferrule technology and mature, higher performance 1.25-mm ceramic ferrule technology. Designers can choose 1.25 mm for system compatibility or MT for density, or use both in the same system. The HD-Optyx connector features a unique plug design that holds and protects the ferrules from handling damaging and is common to both bulkhead solutions, and to blind-mate backplane solutions.

Leveraging the MT ferrule technology, the HD-Optyx platform offers the highest density multi-fiber ferrule solution available, according to the company. Applications include intra-system interconnect via backplane or front access.

"As design activity in the optical networking and high performance computing industries continues to increase, OEMs are seeking reliable and scalable component solutions," says John Lehman, optical product development manager for Teradyne Connection Systems. "The highly modular HD-Optyx platform can be easily configured to accommodate a wide array of applications."

The HD-Optyx connector is engineered to ensure robustness and address concerns on handling and EMI. An innovative shutter design with doors on both the daughtercard and backplane side of the interconnect addresses laser safety concerns while minimizing possible fiber contamination. The HD-Optyx connector, which is available now, is functionally compatible with electrical connector families offered by Teradyne and other suppliers.

Teradyne will exhibit the connector, and other products, February 2-4 at the International Engineering Consortium's DesignCon 2004 conference; Santa Clara Convention Center, Santa Clara, CA; DesignCon East, April 5-7 in Boxborough, MA, and NepCon Shanghai, China, April 26-29, 2004.