AUGUST 16, 2007 -- IntexyS Photonics, developer of high-speed, high-density integrated optical modules, will make its commercial debut at ECOC 2007, to be held September 16-20, in Berlin, Germany.
IntexyS will unveil its miniature optical modules, featuring patented flip-chip and passive alignment technologies to deliver high-bandwidth performance at lower costs for next-generation optical networking, say company representatives. With small form factors incorporating single and parallel channel optics at data rates of 4 Gbits/sec to 10 Gbits/sec, the IntexyS products enable the highest bandwidth per centimeter-squared for highest density performance, claims the company
"We are enabling optical-electronic integration through an innovative technology platform," reports Jean-Charles Garcia, co-founder and CEO of IntexyS. "The technology provides superior capability for building a full, electro-optical 'system-in-a-package' and enables our customers to drive greater optical performance at lower costs for next-generation networking systems."Â
Garcia explains that using a patented flip-chip hybridization technology, IntexyS has developed a wafer-level module approach that enables the integration of various semiconductor dies and optical components directly onto a silicon motherboard. The versatile process allows for a merger of GaAs, InP, and silicon technologies to reduce form factor size and volume production costs while enabling high data rate speeds, he says.
According to Terry Thomas, vice president of sales and marketing for IntexyS, the multi-standard, high-speed transmitters and receivers focus on short- to medium-reach communications, both free space and fiber. He notes that the integrated modules address high-speed serial optical links and massively parallel interconnections for board-to-board and rack-to-rack in telecommunications, data communications, and storage networking as well as for applications in defense, space, and avionics industries.
Thomas says that the IntexyS' technology platform was developed in collaboration with CEA's Electronics and Information Technology Laboratory (LETI). The company was founded in 2002 by CEO Garcia and CTO Régis Hamelin and is headquartered in Toulouse, France.
The company will be exhibiting at ECOC 2007 in Booth # 15025.
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