Molex introduces zSFP+ interconnect system for 56-Gbps channels

Molex has announced the introduction of its zSFP+ interconnect system to support 56-Gbps PAM4 channels in a stacked 2xN port configuration. An upgraded interconnect system, the zSFP+ interconnect system for 56-Gbps channels will support higher speeds and enhanced signal integrity, says Molex.

Molex has announced the introduction of its zSFP+ interconnect system to support 56-Gbps PAM4 channels in a stacked 2xN port configuration. An upgraded interconnect system, the zSFP+ interconnect system for 56-Gbps channels will support higher speeds and enhanced signal integrity, says Molex.

To provide increased flexibility and decreased costs to users, the zSFP+ interconnect system for 56 Gbps features PAM4 channel products that include EMI ganged cages, which are available in multiple port sizes from 2x1 to 2x12, allowing for flexibility of PCB signal routing of LEDs.

Additionally, Molex created a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ Interconnect System. The terminal provides improved signal integrity for 56-Gbps PAM4 applications. According to Molex, users can merge standard cables and modules with the increased data-rate accepted.

The systems configuration features enable next-generation Ethernet and Fibre Channel applications to receive advanced signal integrity, allowing users to address backend challenges from increased bandwidth demand.

"As more devices are connected to the internet and bandwidth demand continues to increase, being able to stay ahead of the curve on the backend becomes more challenging for data centers, networking OEMs and telecoms," said Chris Hagerman, Molex’s global product manager. "Molex provides a passively cooled solution by using an enhanced airflow cage design to maximize airflow through the cage and connector effectively lowering the temperatures by about 17 degrees Celsius. This yields optimal thermal management for next-gen systems while eliminating the need for costly heat sinks or cooling modules."

The system enables OEMs requiring high-density interconnect applications to use channels with individual lane data rates up to 56-Gbps PAM4 in a stacked 2xN configuration. While providing those high speeds, the updated product still maintains the low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment that users are accustomed to from the previous zSFP+ Interconnect System, says Molex.

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