On September 30, Advanced Cooling Technologies, Inc. (ACT) announced that it has been selected to receive $1.1 million in funding from the U.S. Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E).
The funding, part of ARPA-E’s Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) program, will come through two subcontracts, one with Intel in collaboration with Purdue University and one with the University of Missouri.
Dr. William Anderson, ACT’s chief engineer, said the funding is a testament to ACT’s cooling technology capabilities and engineering experience.
“The resulting technologies will enable high rack power density and increase system reliability while at the same time reducing power consumption,” said Anderson in a press release. “This will, in turn, reduce carbon footprint and position the U.S. at the forefront of data center cooling.”
The collaboration with Purdue University is a three-year program that aims to see the development of novel heat sinks by Topology Optimization (TO) to enable two-phase immersion cooling for extremely high-power server devices. The collaboration with the University of Missouri aims to develop a scalable cooling solution for data centers: the dual-mode hybrid two-phase loop.
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