Join EXFO at ECOC 2025 – Future-ready testing for AI Infrastructure
Join our experts at ECOC 2025 in Copenhagen, September 29 – October 1! As AI workloads scale, deploying and troubleshooting high-speed networks right— and faster—becomes more critical than ever.
Visit us on the show floor (booth C4329) to see how streamlined testing helps accelerate AI infrastructure builds, from lab-to-fab testing of integrated photonics to live validation of high-speed transmissions and coherent optics.
Our comprehensive lab-to-live solutions:
- Automated PIC characterization (single die, multi-die or wafer) with test stations (LIVE DEMO at our booth!).
- Scalable electrical to optical validation with testing up to 1.6T.
- Comprehensive coverage and validation of high-speed transmissions, including coherent optics and LPO.
- Accelerated builds for AI clusters for high-density networks and 400G/800G+ transmissions.