Come see our lab-to-fab and fab-to-live test solutions at CIOE
The annual China International Optoelectronic Expo (CIOE) is just around the corner, and we look forward to welcoming you at EXFO's booth (10B53).
We will showcase our latest testing solutions, meticulously designed to automate network operations, accelerate deployment, and ensure stability.
This year, we have invited global experts to demonstrate EXFO's innovative testing solutions across all stages—from lab and manufacturing to field and data center environments. We warmly invite you to visit our booth and engage in in-depth discussions with our specialists.
Our testing solutions include:
- Automated PIC testing, wafer to die.
- 800G/1.6T transceiver (LPO, LRO) and CPO/OIO testing.
- Coherent 400G/800G rates.
- Validation of high-quality networks and DCI for AI workloads.
- AI data center and hollow-core fiber testing.
We look forward to welcoming you at booth 10B53!