US Conec, Ltd.: Next Generation Multi-fiber Connector

Feb. 21, 2024
US Conec's Very Small Form Factor (VSFF) multi-fiber connector, MMC, enables optical fiber density across data center applications, including structured cabling and patch panels, data center interconnects, card-edge and on-card applications.

US Conec's Very Small Form Factor (VSFF) multi-fiber connector, MMC, enables optical fiber density across data center applications, including structured cabling and patch panels, data center interconnects, card-edge and on-card applications. The MMC maximizes the density achieved in each space by offering single-row and dual-row variants. To enable an easy transition from cabling terminated with traditional MPO multi-fiber connectors, the MMC connector was designed with backward compatibility, leveraging the same 250 µm fiber hole pitch as the standard MPO and the same guide borehole diameter and pitch. The MMC connector can be mated directly to an MPO connector. Maintaining a 250 µm pitch for the fiber holes enables flexibility in future technology choices by allowing for compatibility with a range of fiber types, including today's 250 µm fiber to future 200 µm and below fiber types. This allows for the same ferrule and connector for multi-mode fiber, single-mode fiber, low OD single-mode fiber, and specialty fiber types. 

Judge’s Comment: “With the ever-increasing fiber capacities required in hyperscale data centers, this product provides a needed density increase.”

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