OpenLight and Jabil jointly address optical component demand for AI, ML and data center applications

The two companies claim their "Silicon to Solutions" manufacturing approach will drive scale for current and next-generation Photonic Integrated Circuits (PICs).

OpenLight, a PASIC chip design and manufacturing provider, launched a strategic partnership with Jabil, a global manufacturing solutions provider, to streamline and facilitate a back-end manufacturing ecosystem for PICs.

Through this collaboration, OpenLight customers can fast-track the manufacturing and delivery of integrated PICs across various applications and markets, including datacom transceivers, automotive LiDAR, AI/ML, HPC, and healthcare.

As PICs become increasingly critical to address the growing demand for faster data processing, supply chain complexities hinder seamless transitions from silicon wafers to packaged heterogeneous integrated systems. This partnership offers one-stop "Silicon to Solutions" services to accelerate end-to-end production and optimize manufacturing efficiencies – from assembly and packaging to burn-in and testing.

The collaboration aims to eliminate associated supply chain challenges and meet the volume demands of high-bandwidth components for the broad markets both companies serve.

"This will simplify the management of our customers' supply chain, paving the way for scalability as their business grows,” said Dr. Adam Carter, CEO of OpenLight.

Matt Crowley, SVP of Cloud and Enterprise Infrastructure of Jabil agreed and added, "We also have the ability to take these PICs and build them into a wide variety of packaged solutions per our customer's requirements."

For related articles, visit the Optical Tech Topic Center.
For more information on optical components and suppliers, visit the Lightwave Buyer’s Guide.
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About the Author

Sean Buckley

Sean is responsible for establishing and executing the editorial strategy of Lightwave across its website, email newsletters, events, and other information products.

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