TeraCross demos Terabit Switch Fabric for combined TDM and IP systems

17 September 2002 -- TeraCross has demonstrated the GLIMPS-1000 chip-set - a family of switch fabric elements designed for the growing demands of bandwidth and intelligent services in next-generation switching systems - in a multi-service application.

17 September 2002 -- At the Intel Developer Forum, switch fabric IC supplier TeraCross Ltd demonstrated the GLIMPS-1000 chip-set - a family of switch fabric elements designed for the growing demands of bandwidth and intelligent services in next-generation switching systems - in a multi-service application.

TeraCross was founded in 1999 and has offices in Ramat Gan, Israel and Campbell, CA, USA. Investors include Intel Capital, Argoquest Holdings LLC, Ascend Technology Ventures, and Pitango Venture Capital (formerly Polaris, originating in Israel).

GLIMPS-1000 supports concurrent operation of TDM, cell and packet traffic in a single switch fabric. Multiple traffic types can be switched simultaneously while maintaining strict latency and jitter requirements for the TDM flows.

"The multi-service capabilities allow vendors to reduce both cost and system complexity by combining both TDM and packet services in one fabric," says vice president of marketing Kurt Busch.

"The migration from pure SONET to packet-based technologies will be greatly facilitated by multi-service switch fabrics," says Doug Davis, general manager of Intel's Network Processing Division. "We have been working closely with TeraCross to assure a seamless interface between our fully programmable Intel IXP2800 network processor and the TeraCross GLIMPS-1000 switch fabric solution. This will allow system designers to get to market quicker with reliable, high-performance products for edge and metro/core applications".

www.teracross.com

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