Molex unveils 12x pluggable parallel optics modules

22 May 2003 Lisle, IL Lightwave -- Molex Inc. has added a 3.2-Gbit/sec version to its ParaLink Parallel Optical Interconnect product line. The new ParaLink module is a pluggable 12-channel parallel module designed for high-speed high-density optical data transfer applications. The enhanced version increases throughput by 25% over more commonly available devices at 2.5 Gbits/sec per channel, say company representatives.

May 22nd, 2003
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22 May 2003 Lisle, IL Lightwave -- Molex Inc. has added a 3.2-Gbit/sec version to its ParaLink Parallel Optical Interconnect product line. The new ParaLink module is a pluggable 12-channel parallel module designed for high-speed high-density optical data transfer applications. The enhanced version increases throughput by 25% over more commonly available devices at 2.5 Gbits/sec per channel, say company representatives.

The new ParaLink modules are specified at 3.125 Gbits/sec per channel to be compatible with the new generation of XAUI interface chips that have come on the market. The modules can transmit optical data over 300 meters of multimode fiber depending on the type of fiber used. Possible applications include aggregating three 10-Gigabit Ethernet ports to send 30 Gbits of 8B/10B encoded Ethernet traffic or 37.5 Gbits/sec of raw data. Other key applications include high-end video routing equipment, high-density supercomputer interconnections, and terabit routers.

Molex ParaLink-P devices come as a set of separate 12-channel transmitter and receiver modules. The transmitter is based on a Vertical Cavity Surface Emitting Laser (VCSEL) array with active bias and modulation feedback to provide constant optical output over operating range and lifetime. The devices operate on a 3.3-Volt supply and typically draw only 250 mA, providing a very low power consumption, typically 1.6 watts per link, says the company. These modules plug into a 10 x 10 BGA socket previously mounted on the motherboard, allowing for a more flexible final assembly, test, and repair process.

ParaLink pluggable modules have been designed with a low profile of 8.4 mm to enable use with PCI-compliant cards and other height-constrained applications. Modules have a compact 54 x 18-mm size layout, at least a six-fold space savings over SFF and other alternative optoelectronic module implementations. The devices are available with an EMI shroud to provide excellent EMI suppression for front panel mounted applications. The optical interface is an MPO receptacle, which allows easy connection to standard 12-fiber MT-based ribbon cable.

Through a cross-licensing agreement, all Molex ParaLink-P modules are fully pin-out compliant and interoperable with Infineon's PAROLI 2 pluggable parallel optical interconnect devices.

ParaLink 3.125-Gbit/sec modules are available now. Pricing starts at less than $1,000 per transmitter and receiver pair.

Through a cross-licensing agreement, all Molex ParaLink-P modules are fully pin-out compliant and interoperable with Infineon's PAROLI 2 pluggable parallel optical interconnect devices.
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