Digital Optics announced a multi-year supply agreement to supply Agilent Technologies with glass optical sub-assemblies (OSAs) for use in its new 12-channel parallel optics modules. These new parallel-optics modules are designed for network and telecom equipment manufacturers who are developing immensely scalable terabit switches and routers to meet increasing demand for network capacity.
Digital Optics Corporation, the inventor and manufacturer of its Photonic Chip Optical Sub-assemblies (OSAs), has designed and manufactured glass OSAs for reflowable packaging used in the receiver and transmitter of Agilent's parallel-optic modules. For the past six months, components have been manufactured and delivered in volume from Digital Optics Corporation's original four-inch wafer manufacturing facility in Charlotte, NC. The first parts to be manufactured in the company's new 100,000-square-foot, six-inch wafer fabrication facility are expected to ship to Agilent within the next few weeks.
Agilent's parallel-optics modules are designed to solve the data capacity and space problems inherent with copper interconnects and existing optical transceivers. Operating at 2.5 gigabits per second (GB/s) per channel, these new devices combine the 12-channel HFBR-712BP transmitter and HFBR-722BP receiver modules with industry-standard fiberoptic cables and connectors to deliver an aggregate throughput of 30 GB/s while occupying only 38 mm (1.5 inches) of the long dimension of PC boards which are typically 16 to 18 inches in length. The transmitter and receiver pair occupies approximately the same area as two 1 GB/s small form factor (SFF) transceivers, but provides performance 15 times greater.
Aimed at applications such as proprietary system interconnects, OC-192 very short reach (VSR), InfiniBand systems and large multiprocessor system interconnects, Agilent's parallel-optics modules, which utilize Digital Optics Corporation's proprietary Bandwidth Lens diffractive optic, support distances of 300 meters on industry-standard 50/125-micron 500 MHz km (bandwidth-length product) fiber and 600 meters on proposed new 50/125-micron 2000 MHz km high bandwidth fiber. The compact footprint and innovative design of the HFBR-712BP and HFBR-722BP enable high-volume manufacturing at up to 50 percent lower cost than current solutions. An integrated heat sink helps dissipate heat generated by the module into ambient air and not into the circuit board.
About Digital Optics Corporation:
Digital Optics Corporation is develops, designs, manufactures and markets wafer-based passive and active integrated optical sub-assemblies (OSAs). For more information, visit www.doc.com.