Luxtera touts project with Sun Microsystems and DARPA
OCTOBER 21, 2008 -- Luxtera's technology and silicon fabrication processes will be used to develop next-generation optical interconnects to produce chip-to-chip and intra-chip interconnect technology. This project id designed to provide the computing industry with low-cost, enhanced, high-performance computer systems.
OCTOBER 21, 2008 -- Luxtera (search for Luxtera), developer of Silicon CMOS Photonics, has signed a multi-million dollar contract with Sun Microsystems for the Defense Advanced Research Projects Agency's (DARPA) Ultraperformance Nanophotonic Intrachip Communications (UNIC) program.
Luxtera's technology and silicon fabrication processes will be used to develop next-generation optical interconnects to produce chip-to-chip and intra-chip interconnect technology. This project id designed to provide the computing industry with low-cost, enhanced, high-performance computer systems.Â
Luxtera says it is the first company to successfully overcome the complex technical obstacles involved with integrating high-performance optics directly with silicon electronics on a monolithic CMOS chip. Company representatives say their Silicon CMOS Photonics optical I/O technology is providing a more efficient way to construct optical transceivers, thereby increasing efficiency and reliability. For this project, Luxtera is supplying strategic direction, baseline optoelectronic circuits, tools, and device design support for Sun Microsystems and, ultimately, DARPA to produce low-power optical transmitters and receivers.
"We selected Luxtera for its proven technology and processes and overall expertise required for developing next-generation photonics technology for the UNIC program," reports Dr. Jim Mitchell, Sun Fellow & vice president of new technology adoption at Sun Microsystems.Â "They have been extremely successful in the utilization of Silicon CMOS Photonics and delivering direct 'fiber-to-the-chip' connectivity in commercial products."
"A key element of our technology is that we enable fabrication of optical and electronic circuits on a common mainstream CMOS chip," adds Greg Young, CEO of Luxtera. "This capability is the key enabler of next-generation, optically interconnected multi-core processors and computing systems. We are the only company that achieved this capability in high-volume production environments as demonstrated by our first commercial product, Blazar - 40 Gigabit Optical Active Cable," he says. "We are excited that Sun Microsystems is partnering with Luxtera to utilize our technology and processes for the DARPA UNIC program and are confident that both parties will be extremely impressed with our capabilities."