Laser Components launches 1.3-micron HCSEL

June 29, 2006 Hudson, NH -- Laser Components IG claims it has successfully "crossed" a distributed feedback (DFB) laser and a singlemode vertical-cavity surface-emitting laser (SM-VCSEL) on wafer. The resulting horizontal-cavity surface-emitting laser (HCSEL) works uncooled and can be modulated up to 4 Gbits/sec.
Implementing the resonator using a 45-degree mirror instead of the typical 90-degree mirror results in a mostly conventional horizontal resonator with a vertical irradiation.

June 29, 2006 Hudson, NH -- Laser Components IG claims it has successfully "crossed" a distributed feedback (DFB) laser and a singlemode vertical-cavity surface-emitting laser (SM-VCSEL) on wafer. The resulting horizontal-cavity surface-emitting laser (HCSEL) works uncooled and can be modulated up to 4 Gbits/sec.

According to the company, the HCSEL unites the output power of the DFB with the traditional VCSEL advantage of on-wafer testing (which is particularly advantageous in high quantities). The trick is to implement the resonator using a 45-degree mirror instead of the conventional 90-degree mirror, say company representatives. In this way, a mostly conventional horizontal resonator is created, but it still has a vertical irradiation.

The typical output power is 20 mW cw at 30 dB side mode suppression. Prototypes in SOT 4.6 housings can be ordered under the brand name SPECDILAS-H-1300-GMP. Customized products are available in the wavelength range from 1270 to 1700 nm.

Sign up for our eNewsletters
Get the latest news and updates
Sponsored
The demands reshaping digital infrastructure are pushing optical communications into a new era of innovation. AI infrastructure is forcing engineers to rethink how data moves ...
A new wave of investment is creating thousands of new job opportunities throughout the southern United States as we migrate from an information-based economy to an AI-powered ...