AMCC validates with Zarlink's CES access device

DECEMBER 11, 2006 � Applied Micro Circuits Corp. (AMCC) has announced the results of successful interoperability testing between the company's Circuit Emulation Services-over-Packet (CES) technology and Zarlink Semiconductor's ZL 5011x family of CES access devices.

DECEMBER 11, 2006 � Applied Micro Circuits Corp. (AMCC; search for AMCC) has announced the results of successful interoperability testing between the company's Circuit Emulation Services-over-Packet (CES) technology and Zarlink Semiconductor's (search for Zarlink) ZL 5011x family of CES access devices. The combination AMCC's high-density CES device and Zarlink's CES expertise will enable system vendors and carriers to build efficient, scalable (up to multiple OC-3/OC-12) systems and subsystems for legacy T1/E1 and revenue-driven applications, the companies believe.

"By combining our companies' CES technologies and leveraging AMCC's long-established networking expertise, we are providing our customers with the best solutions for all of their system design needs," said Peter Burke, senior vice president and general manager, network communications, Zarlink Semiconductor. "The demonstrated interoperability of our technologies gives customers the benefit of a complete converged end-to-end network solution while still using best-in-class components and technologies at each stage."

AMCC's CES technology delivers the highest density levels on the market today, the company asserts, providing advances in integration as well as real estate and power savings. AMCC's CES offering leverages the company's MISSION and MISSION Access chipsets, as well as AMCC's expertise in packet processing. Furthermore, AMCC says its ability to mix CES and MSP data traffic in the same chipset (MLPP, PPP, IMA) enables customers to reduce overall system design costs and achieve convergence of legacy T1/E1s via IP networks.

Customers will now be able to scale their systems to meet emerging design requirements by using the same core of AMCC hardware and software for OC-3, 2xOC-3, 4xOC-3, and OC-12 data rates. Densities beyond OC-12 can be achieved by adding OC-12 "slices" that require significantly lower chip count, real estate, and power budget, thereby driving down development costs for customers, AMCC says.

"By leveraging our successful MISSION and MISSION Access chipsets, we continue to enable the convergence of data and TDM/voice over the same data connection and support the development of more flexible line cards," said Sam Fuller, vice president of marketing for AMCC. "Networked systems demand complete solutions that are capable of delivering advanced services while providing backward compatibility for the existing infrastructure. AMCC delivers on all fronts, while supplying the CES industry with the highest density solution on the market."

Since system-level features have been proven during the testing demonstration, device-interconnect debug is minimized, which translates into overall reduced time-to-market. The validation of AMCC's SAToP functionality and system configuration provides flexibility for customers to transport CES traffic through AMCC's platform, the company says.

AMCC's CES device is currently alpha sampling with general availability beginning in Q1 2007. An AMCC�Zarlink CES interoperability testing report is available for qualified customers. Zarlink's complete platform of high- and low-density CESoP devices is currently available.

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